Number of Rows :
Voltage Rating :
Insulation Color :
Contact Finish - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Style Current Rating Material Flammability Rating Connector Type Number of Positions Number of Rows Number of Positions Loaded Fastening Type Voltage Rating Contact Material Insulation Color Contact Type Pitch - Mating Shrouding Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material
GLOBAL STOCKS
BKT-163-05-F-V-S-P
RFQ
2,194
In-stock
Samtec Inc. 1MM SURFACE MOUNT STRIP BKT Active Tube -55°C ~ 125°C Surface Mount Solder End Shrouds, Pick and Place Board to Board 2.8A per Contact UL94 V-0 Header 63 2 All Push-Pull - Phosphor Bronze Black Male Pin 0.039" (1.00mm) Shrouded - 4 Wall 0.065" (1.65mm) - - 0.267" (6.78mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
1,243
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) Unshrouded 0.225" (5.72mm) 0.120" (3.05mm) 0.445" (11.30mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
897
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) Unshrouded 0.200" (5.08mm) 0.145" (3.68mm) 0.445" (11.30mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
1,862
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.100" (2.54mm) Unshrouded 0.100" (2.54mm) 0.245" (6.22mm) 0.445" (11.30mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
894-70-063-10-004101
RFQ
3,089
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.587" (14.91mm) 0.118" (3.00mm) 0.805" (20.44mm) 0.100" (2.54mm) Square Gold Flash Gold Polyamide (PA), Nylon, Glass Filled
894-80-063-10-004101
RFQ
1,068
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.587" (14.91mm) 0.118" (3.00mm) 0.805" (20.44mm) 0.100" (2.54mm) Square Tin - Tin Polyamide (PA), Nylon, Glass Filled
894-70-063-10-003101
RFQ
2,710
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.335" (8.51mm) 0.118" (3.00mm) 0.553" (14.04mm) 0.100" (2.54mm) Square Gold Flash Gold Polyamide (PA), Nylon, Glass Filled
894-80-063-10-003101
RFQ
3,335
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.335" (8.51mm) 0.118" (3.00mm) 0.553" (14.04mm) 0.100" (2.54mm) Square Tin - Tin Polyamide (PA), Nylon, Glass Filled
894-70-063-10-002101
RFQ
2,477
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.276" (7.00mm) 0.118" (3.00mm) 0.494" (12.54mm) 0.100" (2.54mm) Square Gold Flash Gold Polyamide (PA), Nylon, Glass Filled
894-80-063-10-002101
RFQ
3,058
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.276" (7.00mm) 0.118" (3.00mm) 0.494" (12.54mm) 0.100" (2.54mm) Square Tin - Tin Polyamide (PA), Nylon, Glass Filled
894-70-063-10-001101
RFQ
1,484
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.236" (6.00mm) 0.122" (3.10mm) 0.458" (11.64mm) 0.100" (2.54mm) Square Gold Flash Gold Polyamide (PA), Nylon, Glass Filled
894-80-063-10-001101
RFQ
2,208
In-stock
Preci-Dip CONN HDR 63POS 2.54MM T/H 894 Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board 3A UL94 V-0 Header 63 3 All Push-Pull 150VDC Brass Black Male Pin 0.100" (2.54mm) Unshrouded 0.236" (6.00mm) 0.122" (3.10mm) 0.458" (11.64mm) 0.100" (2.54mm) Square Tin - Tin Polyamide (PA), Nylon, Glass Filled
M80-7006342
RFQ
3,895
In-stock
Harwin Inc. 3-ROW MALE VERT PC TAIL CONN Datamate J-Tek Active Tray -55°C ~ 125°C Through Hole Solder Mating Flange, Mounting Flange, Mounting Hardware Board to Board or Cable 2.2A per Contact UL94 V-0 Header 63 3 All Threaded 120V Phosphor Bronze Black Male Pin 0.079" (2.00mm) Shrouded - 4 Wall - 0.118" (3.00mm) - 0.244" (6.20mm) Circular Gold 29.5µin (0.75µm) Tin Polyamide (PA46), Nylon 4/6
Default Photo RFQ
RFQ
3,209
In-stock
Harwin Inc. CONN PCB MALE Datamate J-Tek Obsolete Tray -55°C ~ 125°C Through Hole Solder Mating Flange, Mounting Flange, Mounting Hardware Board to Board or Cable 2.2A per Contact UL94 V-0 Header 63 3 All Threaded 120V Phosphor Bronze Black Male Pin 0.079" (2.00mm) Shrouded - 4 Wall - 0.211" (5.35mm) - 0.240" (6.10mm) Circular Gold 29.5µin (0.75µm) Tin Polyamide (PA46), Nylon 4/6
Default Photo RFQ
RFQ
2,261
In-stock
Harwin Inc. CONN PCB MALE Datamate J-Tek Obsolete Tray -55°C ~ 125°C Through Hole Solder Mating Flange, Mounting Flange, Mounting Hardware Board to Board or Cable 2.2A per Contact UL94 V-0 Header 63 3 All Threaded 120V Phosphor Bronze Black Male Pin 0.079" (2.00mm) Shrouded - 4 Wall - 0.211" (5.35mm) - 0.240" (6.10mm) Circular Gold 10.0µin (0.25µm) Gold Polyamide (PA46), Nylon 4/6
Default Photo RFQ
RFQ
690
In-stock
Harwin Inc. 63 WAY VERT MALE CONN T J/S Datamate J-Tek Obsolete Tray -55°C ~ 125°C Through Hole Solder Mating Flange, Mounting Flange, Mounting Hardware Board to Board or Cable 2.2A per Contact UL94 V-0 Header 63 3 All Threaded 120V Phosphor Bronze Black Male Pin 0.079" (2.00mm) Shrouded - 4 Wall - 0.211" (5.35mm) - 0.240" (6.10mm) Circular Gold 29.5µin (0.75µm) Tin-Lead Polyamide (PA46), Nylon 4/6
Default Photo
RFQ
632
In-stock
Mill-Max Manufacturing Corp. CONN HDR PIN 351 Active Bulk - Through Hole Solder - Board to Board - - Header 63 1 All Push-Pull - Brass Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.126" (3.20mm) 0.154" (3.91mm) 0.886" (22.50mm) 0.110" (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Polycyclohexylenedimethylene Terephthalate (PCT)
Default Photo
RFQ
2,108
In-stock
Mill-Max Manufacturing Corp. CONN HDR PIN 351 Active Bulk - Through Hole Solder - Board to Board - - Header 63 1 All Push-Pull - Brass Alloy Black Male Pin 0.100" (2.54mm) Unshrouded 0.126" (3.20mm) 0.154" (3.91mm) 0.886" (22.50mm) 0.110" (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Polycyclohexylenedimethylene Terephthalate (PCT)
Default Photo
RFQ
2,171
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.430" (10.92mm) 0.200" (5.08mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
3,117
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.225" (5.72mm) 0.405" (10.29mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
1,589
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.200" (5.08mm) 0.430" (10.92mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
3,993
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.100" (2.54mm) 0.530" (13.46mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
1,375
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.430" (10.92mm) 0.500" (12.70mm) 1.030" (26.16mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
1,767
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.225" (5.72mm) 0.705" (17.91mm) 1.030" (26.16mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
3,562
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.200" (5.08mm) 0.730" (18.54mm) 1.030" (26.16mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
3,671
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.100" (2.54mm) 0.830" (21.08mm) 1.030" (26.16mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
2,366
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole, Right Angle Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.730" (18.54mm) - - 0.319" (8.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
3,708
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole, Right Angle Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.430" (10.92mm) - - 0.319" (8.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
1,611
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole, Right Angle Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.225" (5.72mm) - - 0.319" (8.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)
Default Photo
RFQ
2,703
In-stock
Samtec Inc. MODIFIED .025 SQUARE POST TERMIN Flex Stack, HMTSW Active Bulk -55°C ~ 125°C Through Hole, Right Angle Solder - Board to Board or Cable 3A UL94 V-0 Header 63 3 All Push-Pull - Phosphor Bronze Natural Male Pin 0.200" (5.08mm) Unshrouded 0.200" (5.08mm) - - 0.319" (8.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP)