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25 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
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1,155
In-stock
|
Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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1,119
In-stock
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Laird Technologies EMI | AP COIL NIB PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
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896
In-stock
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Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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1,331
In-stock
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Leader Tech Inc. | 0.14 X 0.36 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
|
3,741
In-stock
|
Laird Technologies EMI | .140X.370 GASKET FABRIC O/ FOAM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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1,238
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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762
In-stock
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Leader Tech Inc. | 0.14 X 0.36 BD SN 16--FOLDED SER | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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979
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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1,890
In-stock
|
Laird Technologies EMI | AP,STR,NIB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,162
In-stock
|
Laird Technologies EMI | AP,STR,SNB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,106
In-stock
|
Leader Tech Inc. | 0.14 X 0.36 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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2,938
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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672
In-stock
|
Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
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3,818
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,964
In-stock
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Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,405
In-stock
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Laird Technologies EMI | GASKET BECU 9.4X406.40MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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866
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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1,668
In-stock
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Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,298
In-stock
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Laird Technologies EMI | AP,STR,ZNC,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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2,501
In-stock
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Laird Technologies EMI | AP COIL CDY PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Cadmium + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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2,756
In-stock
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Leader Tech Inc. | 0.14 X 0.36 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 25.00 (7.62m) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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2,215
In-stock
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Laird Technologies EMI | AP,STR,BF,USF,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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1,450
In-stock
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Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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1,517
In-stock
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Leader Tech Inc. | 0.14 X 0.36 AG 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Silver | - | Adhesive | ||||
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3,882
In-stock
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Leader Tech Inc. | 0.14 X 0.37 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | ||||
