- Manufacture :
- Series :
- Operating Temperature :
- Plating - Thickness :
- Attachment Method :
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20 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
2,071
In-stock
|
Leader Tech Inc. | 0.06 X 0.50 ST 24--TWIST DOUBLE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Tin | Flash | Adhesive | ||||
|
3,483
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,SNSAT | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
|
1,851
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,SNB,USF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
|
3,298
In-stock
|
Laird Technologies EMI | TWT COIL SNB USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,648
In-stock
|
Laird Technologies EMI | TWT COIL SNSAT USFT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,822
In-stock
|
Laird Technologies EMI | TWT COIL SNB PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,334
In-stock
|
Leader Tech Inc. | 0.07 X 0.14 SN 24--TWIST RIGHT A | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.140" (3.56mm) | Tin | Flash | Adhesive | ||||
|
3,831
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,PSA,POR | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,189
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
896
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,180
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,580
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
711
In-stock
|
Laird Technologies EMI | TWT COIL SNSAT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,280
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
896
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,RAPSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,804
In-stock
|
Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | - | - | ||||
|
2,894
In-stock
|
Leader Tech Inc. | 0.07 X .25 X 045 SN 16--7-21C-04 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | Flash | Adhesive | ||||
|
1,156
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,236
In-stock
|
Leader Tech Inc. | 0.07 X 0.30 ST 24--6-30T-ST-24-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
|
2,914
In-stock
|
Leader Tech Inc. | 0.067 X 0.177 SN 9.0--7-19PCI-SN | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.070" (1.78mm) | 9.000" (228.60mm) | 1.800" (45.72mm) | Tin | Flash | Adhesive | ||||
