Contact Us  |  Terms & Conditions
avia

Sign In.

Hello,WELCOME TO website

My Profile Order Status & History Inquery Address Management
Sign InOrSign Up
  1. Home
  2. Categories
  3. RF/IF and RFID
  4. RFI and EMI - Contacts, Fingerstock and Gaskets
Manufacture :
More
Series :
More
Part Status :
More
Operating Temperature :
More
Height :
More
Width :
More
Applied Filters :
36 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Attachment Method
GLOBAL STOCKS
Default Photo
25-78FSV50-SU-24
RFQ
604
In-stock
 Leader Tech Inc. 0.25 X 0.78 X 0.50 SU 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
25-78FS-SU-24
RFQ
926
In-stock
 Leader Tech Inc. 0.25 X 0.78 SU 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
0C98051502
RFQ
2,584
In-stock
 Laird Technologies EMI NOSG COIL BF USF PSA Foldover Active Beryllium Copper 121°C Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.760" (19.30mm) Unplated Adhesive
Default Photo
6-50T2-BD-24
RFQ
3,173
In-stock
 Leader Tech Inc. 0.06 X 0.50 BD 24--TWIST DOUBLE - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.060" (1.52mm) 24.000" (609.60mm) 0.500" (12.70mm) Unplated Adhesive
Default Photo
6-S-34TV-BD-24
RFQ
1,820
In-stock
 Leader Tech Inc. 0.07 X 0.34 BD 24--TWIST RIGHT A - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.060" (1.52mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
Default Photo
6-S-34T-BD-24
RFQ
683
In-stock
 Leader Tech Inc. 0.07 X 0.34 BD 24--6-S-34T-BD-24 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.060" (1.52mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
Default Photo
6-34TV-BD-24
RFQ
3,754
In-stock
 Leader Tech Inc. 0.07 X 0.14 BD 24--TWIST RIGHT A - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.140" (3.56mm) Unplated Adhesive
Default Photo
6-34T-BD-24
RFQ
1,042
In-stock
 Leader Tech Inc. 0.07 X 0.34 BD 24--6-34T-BD-24-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
Default Photo
3-S-23T-BD-24-NTP
RFQ
832
In-stock
 Leader Tech Inc. 0.03 X 0.23 BD 24 NTP--3-S-23T-B - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
Default Photo
23-S-60FS-BD-24
RFQ
RFQ
1,237
In-stock
 Leader Tech Inc. 0.23 X 0.60 BD 24--FOLDED SERIES - Obsolete Beryllium Copper -55°C ~ 121°C Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.600" (15.24mm) Unplated Adhesive
0C98055902
0C98055902
RFQ
3,260
In-stock
 Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
0C97055502
0C97055502
RFQ
3,286
In-stock
 Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
0C97055902
0C97055902
RFQ
3,592
In-stock
 Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
Default Photo
0C98050002
RFQ
2,250
In-stock
 Laird Technologies EMI AP COIL BF USFT PSA All-Purpose Active Beryllium Copper 121°C Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.600" (15.24mm) Unplated Adhesive
Default Photo
25-109FSDS-BD-24
RFQ
2,504
In-stock
 Leader Tech Inc. 0.25 X 1.09 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.250" (6.35mm) 24.000" (609.60mm) 1.090" (27.69mm) Unplated Adhesive
Default Photo
3-S-23TV-BD-24
RFQ
2,119
In-stock
 Leader Tech Inc. 0.03 X 0.23 BD 24--TWIST RIGHT A - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
Default Photo
3-S-23T-BD-24
RFQ
2,837
In-stock
 Leader Tech Inc. 0.03 X 0.23 BD 24--3-S-23T-BD-24 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
Default Photo
3-23TV30-BD-24
RFQ
3,643
In-stock
 Leader Tech Inc. 0.03 X 0.08 BD 24--TWIST RIGHT A - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.080" (2.03mm) Unplated Adhesive
Default Photo
3-23TV-BD-24
RFQ
1,500
In-stock
 Leader Tech Inc. 0.03 X 0.08 BD 24--TWIST RIGHT A - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.080" (2.03mm) Unplated Adhesive
Default Photo
3-23T-BD-24-NTP
RFQ
627
In-stock
 Leader Tech Inc. 0.03 X 0.23 BD 24 NTP--3-23T-BD- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
Default Photo
3-23T-BD-24
RFQ
3,201
In-stock
 Leader Tech Inc. 0.03 X 0.23 BD 24--3-23T-BD-24-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
Default Photo
3-20T-BD-24-NTP
RFQ
3,885
In-stock
 Leader Tech Inc. 0.03 X 0.20 BD 24 NTP--3-20T-BD- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.200" (5.08mm) Unplated Adhesive
Default Photo
3-20T-BD-24
RFQ
1,360
In-stock
 Leader Tech Inc. 0.03 X 0.20 BD 24--3-20T-BD-24-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.200" (5.08mm) Unplated Adhesive
0C97055002
0C97055002
RFQ
3,781
In-stock
 Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
Default Photo
23-S-76FSC-BD-24
RFQ
922
In-stock
 Leader Tech Inc. 0.23 X 0.76 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.760" (19.30mm) Unplated Adhesive
Default Photo
25-S-78FS-BD-24
RFQ
3,047
In-stock
 Leader Tech Inc. 0.25 X 0.78 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
23-76FSC-BD-24
RFQ
3,709
In-stock
 Leader Tech Inc. 0.23 X 0.76 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.760" (19.30mm) Unplated Adhesive
Default Photo
25-78FS-BD-24
RFQ
1,693
In-stock
 Leader Tech Inc. 0.25 X 0.78 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
25-S-78FSV50-BD-24
RFQ
1,204
In-stock
 Leader Tech Inc. 0.25 X 0.78 X 0.50 BD 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
23-60FS-BD-24-NTP
RFQ
3,632
In-stock
 Leader Tech Inc. 0.23 X 0.60 BD 24 NTP--FOLDED SE - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.600" (15.24mm) Unplated Adhesive
1 / 2
＜Prev Next＞