Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
3,420
In-stock
Leader Tech Inc. 0.07 X 0.13 BD 12--7-13U-BD-12-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.070" (1.78mm) 12.000" (304.80mm) 0.130" (3.30mm) Unplated Adhesive
Default Photo
RFQ
3,754
In-stock
Leader Tech Inc. 0.07 X 0.14 BD 24--TWIST RIGHT A - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.070" (1.78mm) 24.000" (609.60mm) 0.140" (3.56mm) Unplated Adhesive
Default Photo
RFQ
1,042
In-stock
Leader Tech Inc. 0.07 X 0.34 BD 24--6-34T-BD-24-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
Default Photo
RFQ
806
In-stock
Leader Tech Inc. 0.067 X 0.177 BD 18--7-19PCI-BD- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.070" (1.78mm) 18.000" (457.20mm) 1.800" (45.72mm) Unplated Adhesive
Default Photo
RFQ
3,941
In-stock
Leader Tech Inc. 0.067 X 0.177 BD 16--7-19PCI-BD- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.070" (1.78mm) 16.000" (406.40mm) 1.800" (45.72mm) Unplated Adhesive
0C98055902
RFQ
3,260
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
0C97055502
RFQ
3,286
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
0C97055902
RFQ
3,592
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
Default Photo
RFQ
2,683
In-stock
Leader Tech Inc. 0.07 X 0.34 BD 300--6-34T-BD-300 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.070" (1.78mm) 25.00 (7.62m) 0.340" (8.64mm) Unplated Adhesive
Default Photo
RFQ
2,019
In-stock
Leader Tech Inc. 0.07 X .25 X 045 BD 16--7-21C-04 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.070" (1.78mm) 16.000" (406.40mm) 0.250" (6.35mm) Unplated Adhesive