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57 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
3,484
In-stock
|
Leader Tech Inc. | 0.14 X 0.38 ZINC 16--14-38AH-ZIN | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | Flash | Adhesive | ||||
|
1,261
In-stock
|
Leader Tech Inc. | 0.14 X 0.38 SN 16--14-38AH-SN-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | Flash | Adhesive | ||||
|
1,155
In-stock
|
Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
|
2,060
In-stock
|
Laird Technologies EMI | S3,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
|
2,928
In-stock
|
Laird Technologies EMI | S3,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
|
1,119
In-stock
|
Laird Technologies EMI | AP COIL NIB PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
896
In-stock
|
Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
|
956
In-stock
|
Laird Technologies EMI | S3,STR,NIB,USFT,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,969
In-stock
|
Laird Technologies EMI | S3,STR,SNB,USFT,RIVIT | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,552
In-stock
|
Leader Tech Inc. | 0.14 X 0.51 SN 16.0--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | Flash | Adhesive | ||||
|
3,398
In-stock
|
Leader Tech Inc. | 0.14 X 0.510 NI 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | Flash | Adhesive | ||||
|
1,331
In-stock
|
Leader Tech Inc. | 0.14 X 0.36 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
|
|
3,741
In-stock
|
Laird Technologies EMI | .140X.370 GASKET FABRIC O/ FOAM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
|
1,238
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
|
762
In-stock
|
Leader Tech Inc. | 0.14 X 0.36 BD SN 16--FOLDED SER | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
|
979
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
|
1,890
In-stock
|
Laird Technologies EMI | AP,STR,NIB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
2,162
In-stock
|
Laird Technologies EMI | AP,STR,SNB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,671
In-stock
|
Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,106
In-stock
|
Leader Tech Inc. | 0.14 X 0.36 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
|
1,749
In-stock
|
Leader Tech Inc. | 0.14 X 0.45 BD 15--14-45DT-BD-15 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
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3,632
In-stock
|
Leader Tech Inc. | 0.14 X 0.510 BD 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Unplated | - | Adhesive | ||||
|
2,938
In-stock
|
Leader Tech Inc. | 0.14 X 0.37 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
|
2,266
In-stock
|
Laird Technologies EMI | S3,STR,BF,USF,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
|
672
In-stock
|
Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
3,818
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,964
In-stock
|
Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,405
In-stock
|
Laird Technologies EMI | GASKET BECU 9.4X406.40MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
|
2,152
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
998
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
