Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Interface Voltage - Supply Embedded Utilized IC / Part Supplied Contents Sensor Type Sensing Range
GLOBAL STOCKS
EV_MOD_ICU-10201-00
RFQ
6
In-stock
TDK InvenSense CHIP PART NUMBER ICU-10201 $proddata[$product['id']]['package'] Serial, SPI 1.8V Yes, MCU ICU-10201 Board(s) Ultrasonic, 3D Time-of-Flight (ToF) 100mm ~ 1.2m
Default Photo
RFQ
10
In-stock
TDK InvenSense EVAL BOARD ICU-20201 180DEG $proddata[$product['id']]['package'] Serial, SPI 1.8V - ICU-20201 Board(s) Ultrasonic, 3D Time-of-Flight (ToF) -
Default Photo
RFQ
10
In-stock
TDK InvenSense EVAL BOARD FOR ICU-20201 $proddata[$product['id']]['package'] Serial, SPI 1.8V - ICU-20201 Board(s) Ultrasonic, 3D Time-of-Flight (ToF) -
DK-CH201
RFQ
24
In-stock
TDK InvenSense CHIRP CH-201 DEVELOPMENT BOARD, $proddata[$product['id']]['package'] I2C, Serial 1.8V - CH-201 Board(s) Ultrasonic, 3D Time-of-Flight (ToF) -
EV_ICU-10201-00
RFQ
VIEW
RFQ
TDK InvenSense CHIP PART NUMBER ICU-10201 $proddata[$product['id']]['package'] Serial, SPI 1.8V Yes, MCU ICU-10201 Board(s) Ultrasonic, 3D Time-of-Flight (ToF) 100mm ~ 1.2m
EV_MOD_CH101-01-02
RFQ
142
In-stock
TDK InvenSense CHIRP EVALUATION MODULE CH101 $proddata[$product['id']]['package'] I2C 1.62V ~ 1.98V - CH101 Board(s) Ultrasonic, 3D Time-of-Flight (ToF) 4cm ~ 1.2m
EV_MOD_CH201-00-01
RFQ
205
In-stock
TDK InvenSense CHIRP EVAL BRD FOR CH201 $proddata[$product['id']]['package'] I2C 1.8V - CH-201 Board(s) Ultrasonic, 3D Time-of-Flight (ToF) -