- Specifications :
-
- - (2)
- 100mm x 50mm (1)
- Active Cooling for COM Express Conga-TR4 Module with Integrated Heat Pipes, 20mm High Heat Sink, and 12V Fan, 2.7mm (1)
- Active Cooling for COM Express Conga-TS170/TS175 Module with Integrated Heat Pipes, 21mm High Heat Sink, and 12V Fan, 2.7mm (1)
- Active Cooling for COM Express Type 7 Conga-B7AC Module with Integrated Copper Plate, 20mm High Heat Sink, 12V Fan, 2.7mm (1)
- Active Cooling for COM Express Type 7 Conga-B7XD Module with Integrated Heat Pipes, 30mm Heat Sink, 70mm 12V (PWM) Fan, 2.7mm (1)
- Aluminum, 24g (1)
- Analog Input Chip, -40° to +85°C (1)
- ARMADA Heatsink (1)
- Compatible with Khadas Edge, 3705 Cooling Fan (1)
- EDM Compact 12mm Passive Heat Sink (1)
- Fanless (1)
- For Trenz Electronic Module TE0741-05 (1)
- For Trenz Electronic Module TE0820/TE0821 (1)
- Heat Sink + Cooling fan assembly to mount on product heat plate (2)
- Heat Sink for TE0803 Modules (1)
- Heat Sink for TE0808 Modules (1)
- Heat Sink for TE082x/TE0841 Modules (1)
- Heat Sink with Fan (1)
- Heat Sink with Fan (for development use) (1)
- Heat Spreader for COM Express Conga-TS170/TS175 Module with Integrated Heat Pipes, 2.7mm (1)
- i.MX6 Heatsink (1)
- i.MX8M Heatsink (1)
- Pad for Metal Plate (1)
- Passive Cooling for COM Express Conga-TCA5 Compact Module with Lidded Intel Atom Processor, 2.5mm Thread (1)
- Passive Cooling for COM Express Conga-TCA5 Compact Module with Lidded Intel Atom Processor, 2.7mm (1)
- Passive Cooling for for Mini-ITX conga IA5, (For modules with standard non lidded CP) (1)
- Passive Cooling for for Mini-ITX conga-IA5 (For modules with IHS CPU) (1)
- Passive Cooling for for Pico-ITX conga-PA5, Non-Lidded (1)
- Passive Cooling for for Pico-ITX conga-PA6, Lidded (1)
- Passive Cooling for Qseven Conga-QA5 Module with Lidded Intel Atom Processor, 2.7mm (1)
- Passive Cooling for Qseven Conga-QA5 Module with open silicon Intel Pentium and Celeron Processors, 2.7mm (1)
- Passive Cooling for Qseven Conga-QMX8 Module with Lidded NXP i.MX8 ARM Cortex® A72 Processor, 2.5mm Thread (1)
- Passive Cooling for SMARC 2.0 Conga-SMX8 Module with Lidded NXP i.MX8 Quad Max ARM Processor, 2.7mm (1)
- Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. (1)
- Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. (1)
- Passive, Heat Plate Mount (4)
- PC/104-Plus (1)
- Applied Filters :
43 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Accessory Type | Specifications | |
|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||
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1
In-stock
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congatec | HEATSINK W/12V FAN CQM EXPRESS | $proddata[$product['id']]['package'] | Heat Sink | Active Cooling for COM Express Conga-TS170/TS175 Module with Integrated Heat Pipes, 21mm High Heat Sink, and 12V Fan, 2.7mm | |||
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VIEW | Trenz Electronic GmbH | HEAT SINK INCLUDING FAN FOR TREN | $proddata[$product['id']]['package'] | Heat Sink | Heat Sink with Fan | |||
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1
In-stock
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congatec | HEATSINK CQM EXPRESS W/HEATPIP | $proddata[$product['id']]['package'] | Heat Sink | Heat Spreader for COM Express Conga-TS170/TS175 Module with Integrated Heat Pipes, 2.7mm | |||
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VIEW | Trenz Electronic GmbH | HEAT SINK FOR TRENZ ELECTRONIC M | $proddata[$product['id']]['package'] | Heat Sink | Heat Sink for TE0808 Modules | |||
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1
In-stock
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congatec | HEATSINK FOR COM EXPRESS TCA5 | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for COM Express Conga-TCA5 Compact Module with Lidded Intel Atom Processor, 2.5mm Thread | |||
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VIEW | Trenz Electronic GmbH | HEAT SINK SUPERGRIP FOR TRENZ EL | $proddata[$product['id']]['package'] | Heat Sink | Heat Sink for TE0803 Modules | |||
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1
In-stock
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congatec | HEATSINK FOR ATOM 12MM FINS | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for for Pico-ITX conga-PA6, Lidded | |||
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1
In-stock
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congatec | HEATSINK FOR COM EXPRESS TCA5 | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for COM Express Conga-TCA5 Compact Module with Lidded Intel Atom Processor, 2.7mm | |||
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VIEW | Advantech Corp | QSEVEN SEMI-HEATSINK, 70L X 63W | $proddata[$product['id']]['package'] | Heat Sink | Analog Input Chip, -40° to +85°C | |||
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1
In-stock
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congatec | SMARC 2.0 PASSIVE COOLING SOLUT | $proddata[$product['id']]['package'] | Heat Sink | Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | |||
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VIEW | Trenz Electronic GmbH | HEAT SINK FOR TRENZ ELECTRONIC M | $proddata[$product['id']]['package'] | Heat Sink | For Trenz Electronic Module TE0741-05 | |||
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VIEW | Trenz Electronic GmbH | HEAT SINK FOR TRENZ ELECTRONIC M | $proddata[$product['id']]['package'] | Heat Sink | For Trenz Electronic Module TE0820/TE0821 | |||
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1
In-stock
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congatec | CPU BOARD QSEVEN INTEL ATOM | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for Qseven Conga-QA5 Module with open silicon Intel Pentium and Celeron Processors, 2.7mm | |||
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1
In-stock
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congatec | HEATSINK FOR ATOM IA5 12MM FIN | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for for Mini-ITX conga-IA5 (For modules with IHS CPU) | |||
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1
In-stock
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congatec | PASSIVE COOLING QSEVEN CONGA-QA5 | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for Qseven Conga-QA5 Module with Lidded Intel Atom Processor, 2.7mm | |||
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1
In-stock
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iBASE Technology | IB113A HEATSINK HSIB113A-BGA-A | $proddata[$product['id']]['package'] | Heat Sink | - | |||
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1
In-stock
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congatec | HEATSINK FOR MINI ITX IA5 12MM F | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for for Mini-ITX conga IA5, (For modules with standard non lidded CP) | |||
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VIEW | Advantech Corp | SEMI-HEAT SINK FOR SMARC | $proddata[$product['id']]['package'] | Heat Sink | - | |||
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VIEW | SolidRun LTD | I.MX8M HEATSINK KIT | $proddata[$product['id']]['package'] | Heat Sink | i.MX8M Heatsink | |||
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VIEW | SolidRun LTD | ARMADA HEATSINK KIT | $proddata[$product['id']]['package'] | Heat Sink | ARMADA Heatsink | |||
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1
In-stock
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congatec | HEATSINK W/12V FAN QSEVEN | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for Qseven Conga-QMX8 Module with Lidded NXP i.MX8 ARM Cortex® A72 Processor, 2.5mm Thread | |||
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VIEW | SolidRun LTD | I.MX6 HEATSINK KIT | $proddata[$product['id']]['package'] | Heat Sink | i.MX6 Heatsink | |||
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VIEW | Trenz Electronic GmbH | HEAT SINK FOR TRENZ ELECTRONIC M | $proddata[$product['id']]['package'] | Heat Sink | Heat Sink for TE082x/TE0841 Modules | |||
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VIEW | Khadas | BLUE, THERMAL PAD | $proddata[$product['id']]['package'] | Heat Sink | Pad for Metal Plate | |||
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VIEW | VersaLogic Corporation | HEAT SINK WITH FAN (FOR DEVELOPM | $proddata[$product['id']]['package'] | Heat Sink | Heat Sink with Fan (for development use) | |||
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7
In-stock
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Diamond Systems | HEAT SINK FOR FLOYD NANO / NX | $proddata[$product['id']]['package'] | Heat Sink | 100mm x 50mm | |||
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24
In-stock
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Khadas | PASSIVE VIM HEATSINK | $proddata[$product['id']]['package'] | Heat Sink | Aluminum, 24g | |||
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VIEW | Diamond Systems | PC/104 HEAT SINK, 0.5" HEIGHT | $proddata[$product['id']]['package'] | Heat Sink | PC/104-Plus | |||
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VIEW | congatec | SMARC 2.0 PASSIVE COOLING SOLUT | $proddata[$product['id']]['package'] | Heat Sink | Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | |||
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VIEW | congatec | HEATSINK FOR SMARC 2.0 NXP | $proddata[$product['id']]['package'] | Heat Sink | Passive Cooling for SMARC 2.0 Conga-SMX8 Module with Lidded NXP i.MX8 Quad Max ARM Processor, 2.7mm | |||
