- Operating Temperature :
- Package / Case :
-
- 16-VFQFN Exposed Pad (8)
- 16-VFQFN Exposed Pad, 16-MLF® (9)
- 20-TSSOP (0.173", 4.40mm Width) (2)
- 32-LQFP (19)
- 32-TQFP (6)
- 32-VFQFN Exposed Pad (5)
- 32-VFQFN Exposed Pad, 32-MLF® (4)
- 32-WFQFN Exposed Pad (4)
- 44-VFQFN Exposed Pad, 44-MLF® (4)
- 64-VFQFN Exposed Pad (1)
- 8-SOIC (0.154", 3.90mm Width) (21)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) (22)
- 8-VFDFN Exposed Pad (3)
- 8-VFDFN Exposed Pad, 8-MLF® (13)
- SOT-23-8 (2)
- Type :
- Supplier Device Package :
-
- 16-MLF® (3x3) (9)
- 16-QFN (3x3) (4)
- 16-VFQFN (3x3) (3)
- 16-VFQFPN (3x3) (1)
- 20-TSSOP (2)
- 32-LQFP (7x7) (12)
- 32-LQFP/32-TQFP (7x7) (4)
- 32-MLF® (5x5) (4)
- 32-QFN (5x5) (5)
- 32-TQFN (5x5) (3)
- 32-TQFN-EP (5x5) (1)
- 32-TQFP (7x7) (9)
- 44-MLF® (7x7) (4)
- 64-QFN (9x9) (1)
- 8-DFN (2x2) (3)
- 8-MLF® (2x2) (13)
- 8-MSOP (6)
- 8-SOIC (21)
- 8-TSSOP (10)
- 8-uMAX (6)
- Number of Circuits :
- Input :
- Applied Filters :
122 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Type | Frequency - Max | Supplier Device Package | Number of Circuits | Voltage - Supply | Output | Input | Ratio - Input:Output | Differential - Input:Output | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
RFQ |
2,192
In-stock
|
Maxim Integrated | IC CLK BUFFER 2:2 3GHZ 8SOIC | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-SOIC | 1 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 2:2 | Yes/Yes | |||
|
|
RFQ |
1,189
In-stock
|
Maxim Integrated | IC CLK BUFFER 2:2 3GHZ 8SOIC | - | Active | Tube | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-SOIC | 1 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 2:2 | Yes/Yes | |||
|
3,724
In-stock
|
Maxim Integrated | IC CLK BUFFER 2:10 32TQFP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 32-LQFP | Fanout Buffer (Distribution), Multiplexer, Data | 3GHz | 32-TQFP (7x7) | 1 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 2:10 | Yes/Yes | ||||
|
2,747
In-stock
|
Maxim Integrated | IC CLK BUFFER 1:5 | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 32-LQFP | Fanout Buffer (Distribution), Data | 3GHz | 32-LQFP (7x7) | 2 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 1:5 | Yes/Yes | ||||
|
|
2,490
In-stock
|
Maxim Integrated | IC CLK BUFFER 1:5 3GHZ 32LQFP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 32-LQFP | Fanout Buffer (Distribution), Data | 3GHz | 32-LQFP/32-TQFP (7x7) | 2 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 1:5 | Yes/Yes | ||||
|
|
964
In-stock
|
Maxim Integrated | IC CLK BUFFER 2:10 3GHZ 32LQFP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 32-LQFP | Fanout Buffer (Distribution), Multiplexer, Data | 3GHz | 32-LQFP/32-TQFP (7x7) | 1 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 2:10 | Yes/Yes | ||||
|
|
1,214
In-stock
|
IDT, Integrated Device Technology Inc | IC CLK BUFFER 2:6 3GHZ 32TQFP | 100ES | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | 32-LQFP | Fanout Buffer (Distribution), Multiplexer | 3GHz | 32-TQFP (7x7) | 1 | 2.375 V ~ 3.465 V | LVPECL | LVCMOS, LVPECL | 2:6 | Yes/Yes | ||||
|
2,816
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:4 3GHZ 16QFN | ECLinPS MAX™ | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | Fanout Buffer (Distribution) | 3GHz | 16-QFN (3x3) | 1 | 2.375 V ~ 3.63 V | LVCMOS, LVPECL | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:4 | Yes/Yes | ||||
|
|
3,196
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:4 3GHZ 16QFN | ECLinPS MAX™ | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | Fanout Buffer (Distribution) | 3GHz | 16-QFN (3x3) | 1 | 2.375 V ~ 3.63 V | CML | CML, LVDS, LVPECL | 1:4 | Yes/Yes | ||||
|
1,136
In-stock
|
Maxim Integrated | IC CLK BUFFER 2:2 3GHZ 8UMAX | - | Active | Tube | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-uMAX | 1 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 2:2 | Yes/Yes | ||||
|
3,485
In-stock
|
IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:2 3GHZ 16 VQFP | - | Active | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | Fanout Buffer (Distribution) | 3GHz | 16-VFQFN (3x3) | 1 | 2.375 V ~ 3.63 V | ECL, LVPECL | CML, ECL, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
|
RFQ |
1,047
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:2 3GHZ 8TSSOP | 100EP | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-TSSOP | 1 | 3 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | |||
|
|
2,934
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:2 3GHZ 8TSSOP | 100EP | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-TSSOP | 1 | 3 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | ||||
|
|
2,083
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:2 3GHZ 8TSSOP | 100EP | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-TSSOP | 1 | 3 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | ||||
|
RFQ |
1,023
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MSOP | 100EP, ECL Pro® | Active | Digi-Reel® | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-MSOP | 1 | 2.375 V ~ 5.5 V | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 1:2 | Yes/Yes | |||
|
|
1,874
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MSOP | 100EP, ECL Pro® | Active | Cut Tape (CT) | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-MSOP | 1 | 2.375 V ~ 5.5 V | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 1:2 | Yes/Yes | ||||
|
|
1,451
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MSOP | 100EP, ECL Pro® | Active | Tape & Reel (TR) | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-MSOP | 1 | 2.375 V ~ 5.5 V | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 1:2 | Yes/Yes | ||||
|
RFQ |
930
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8SOIC | 100EP, ECL Pro® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-SOIC | 1 | 2.375 V ~ 5.5 V | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 1:2 | Yes/Yes | |||
|
|
3,122
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8SOIC | 100EP, ECL Pro® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-SOIC | 1 | 2.375 V ~ 5.5 V | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 1:2 | Yes/Yes | ||||
|
|
2,112
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8SOIC | 100EP, ECL Pro® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-SOIC | 1 | 2.375 V ~ 5.5 V | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 1:2 | Yes/Yes | ||||
|
|
3,856
In-stock
|
Maxim Integrated | IC CLK BUFFER 2:10 3GHZ 32LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 32-LQFP | Fanout Buffer (Distribution), Multiplexer, Data | 3GHz | 32-LQFP/32-TQFP (7x7) | 1 | 2.25 V ~ 3.8 V | LVECL, LVPECL | HSTL, LVECL, LVPECL | 2:10 | Yes/Yes | ||||
|
|
2,643
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8MSOP | 100EP, ECL Pro® | Active | Tube | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-MSOP | 1 | 2.375 V ~ 5.5 V | LVECL, LVPECL | LVECL, LVPECL | 1:2 | Yes/Yes | ||||
|
|
1,789
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 8SOIC | 100EP, ECL Pro® | Active | Tube | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-SOIC | 1 | 2.375 V ~ 5.5 V | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 1:2 | Yes/Yes | ||||
|
|
2,592
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:2 3GHZ 8TSSOP | 10EP | Active | Tube | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-TSSOP | 1 | 3 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | ||||
|
3,194
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:2 3GHZ 8SOIC | 100EP | Active | Tube | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-SOIC | 1 | 3 V ~ 5.5 V | ECL, PECL | ECL, PECL | 1:2 | Yes/Yes | ||||
|
|
3,148
In-stock
|
ON Semiconductor | IC CLK BUFFER 1:2 3GHZ 8TSSOP | 100LVEP | Active | Tube | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Fanout Buffer (Distribution) | 3GHz | 8-TSSOP | 1 | 2.375 V ~ 3.8 V | ECL, PECL | CML, LVDS, PECL | 1:2 | Yes/Yes | ||||
|
3,048
In-stock
|
Microchip Technology | IC CLK BUFFER 1:2 3GHZ 16MLF | Precision Edge® | Active | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution) | 3GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.635 V | LVDS | CML, LVDS, LVPECL | 1:2 | Yes/Yes | ||||
|
RFQ |
1,928
In-stock
|
Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:1 | Yes/Yes | |||
|
|
2,862
In-stock
|
Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
|
|
3,338
In-stock
|
Microchip Technology | IC CLK BUFFER 1:1 3GHZ 8MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF® | Buffer/Driver | 3GHz | 8-MLF® (2x2) | 1 | 2.375 V ~ 3.6 V | CML | CML, LVDS, LVPECL | 1:1 | Yes/Yes | ||||
