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36 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Type | Frequency - Max | Supplier Device Package | Number of Circuits | Voltage - Supply | Output | Input | Ratio - Input:Output | Differential - Input:Output | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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2,021
In-stock
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Analog Devices Inc. | IC CLK BUFFER 1:3 1.6GHZ 32LFCSP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | Fanout Buffer (Distribution), Divider | 1.6GHz | 32-LFCSP-VQ (5x5) | 1 | 3.135 V ~ 3.465 V | CMOS, LVDS, LVPECL | Clock | 1:3 | Yes/Yes | ||||
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3,071
In-stock
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Texas Instruments | IC CLK BUFFER 1:3 800MHZ 24VQFN | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 800MHz | 24-VQFN-EP (4x4) | 1 | 3 V ~ 3.6 V | LVCMOS, LVPECL | CML, HSTL, LVDS, LVPECL, SSTL-2, VML | 1:3 | Yes/Yes | ||||
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1,053
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2.5GHZ 16MLF | Precision Edge® | Active | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2.5GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.63 V | LVPECL | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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3,216
In-stock
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Analog Devices Inc. | IC CLK BUFFER 1:3 800MHZ 32LFCSP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | Fanout Buffer (Distribution), Divider | 800MHz | 32-LFCSP-VQ (5x5) | 1 | 3.135 V ~ 3.465 V | CMOS, LVDS | Clock | 1:3 | Yes/Yes | ||||
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3,112
In-stock
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Analog Devices Inc. | IC CLK BUFFER 1:3 1.6GHZ 32LFCSP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | Fanout Buffer (Distribution), Divider | 1.6GHz | 32-LFCSP-VQ (5x5) | 1 | 3.135 V ~ 3.465 V | CMOS, LVDS, LVPECL | Clock | 1:3 | Yes/Yes | ||||
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RFQ |
1,018
In-stock
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Analog Devices Inc. | IC CLK BUFFER 1:3 800MHZ 32LFCSP | - | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | Fanout Buffer (Distribution), Divider | 800MHz | 32-LFCSP-VQ (5x5) | 1 | 3.135 V ~ 3.465 V | CMOS, LVDS | Clock | 1:3 | Yes/Yes | |||
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3,459
In-stock
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Analog Devices Inc. | IC CLK BUFFER 1:3 800MHZ 32LFCSP | - | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | Fanout Buffer (Distribution), Divider | 800MHz | 32-LFCSP-VQ (5x5) | 1 | 3.135 V ~ 3.465 V | CMOS, LVDS | Clock | 1:3 | Yes/Yes | ||||
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3,391
In-stock
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Analog Devices Inc. | IC CLK BUFFER 1:3 800MHZ 32LFCSP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | Fanout Buffer (Distribution), Divider | 800MHz | 32-LFCSP-VQ (5x5) | 1 | 3.135 V ~ 3.465 V | CMOS, LVDS | Clock | 1:3 | Yes/Yes | ||||
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RFQ |
3,166
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2GHZ 16MLF | Precision Edge® | Discontinued at Digi-Key | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2GHz | 16-MLF® (3x3) | 1 | 2.97 V ~ 3.63 V | LVDS | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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RFQ |
2,376
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2.5GHZ 16MLF | Precision Edge® | Discontinued at Digi-Key | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2.5GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.63 V | LVPECL | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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RFQ |
3,409
In-stock
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IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:3 2GHZ 16VFQFN | - | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 2GHz | 16-VFQFN (3x3) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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RFQ |
1,468
In-stock
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IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:3 2GHZ 16VFQFN | - | Obsolete | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 2GHz | 16-VFQFN (3x3) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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RFQ |
2,692
In-stock
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IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:3 2GHZ 16VFQFN | - | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 2GHz | 16-VFQFN (3x3) | 1 | 2.375 V ~ 3.63 V | LVPECL | CML, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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RFQ |
3,448
In-stock
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IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:3 2GHZ 16VFQFN | - | Obsolete | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 2GHz | 16-VFQFN (3x3) | 1 | 2.375 V ~ 3.63 V | LVPECL | CML, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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3,011
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.8GHZ | - | Active | Tape & Reel (TR) | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.8GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVPECL | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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3,521
In-stock
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Texas Instruments | IC CLK BUFFER 1:3 800MHZ 24VQFN | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 800MHz | 24-VQFN-EP (4x4) | 1 | 3 V ~ 3.6 V | LVCMOS, LVPECL | CML, HSTL, LVDS, LVPECL, SSTL-2, VML | 1:3 | Yes/Yes | ||||
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1,449
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.4GHZ | - | Active | Tape & Reel (TR) | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.4GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVCMOS, LVDS | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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3,403
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.4GHZ | - | Active | Tape & Reel (TR) | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.4GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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1,475
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.4GHZ | - | Active | Tape & Reel (TR) | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.4GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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RFQ |
713
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2GHZ 16MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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1,457
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2GHZ 16MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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1,121
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2GHZ 16MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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2,599
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.8GHZ | - | Active | Tube | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.8GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVPECL | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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791
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.4GHZ | - | Active | Tube | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.4GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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RFQ |
2,103
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2.5GHZ 16MLF | Precision Edge® | Active | Digi-Reel® | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2.5GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.63 V | LVPECL | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | |||
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3,768
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2.5GHZ 16MLF | Precision Edge® | Active | Cut Tape (CT) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2.5GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.63 V | LVPECL | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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3,982
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2.5GHZ 16MLF | Precision Edge® | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2.5GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 3.63 V | LVPECL | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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3,896
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.4GHZ | - | Active | Tube | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.4GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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1,466
In-stock
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Linear Technology/Analog Devices | IC CLK BUFFER 1:3 1.4GHZ | - | Active | Tube | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | Fanout Buffer (Distribution), Divider | 1.4GHz | 36-QFN (4x7) | 1 | 3.15 V ~ 3.45 V | LVCMOS, LVDS | LVCMOS, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
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3,312
In-stock
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Microchip Technology | IC CLK BUFFER 1:3 2GHZ 16MLF | Precision Edge® | Active | Tube | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF® | Fanout Buffer (Distribution), Divider | 2GHz | 16-MLF® (3x3) | 1 | 2.375 V ~ 2.625 V | LVDS | CML, HSTL, LVDS, LVPECL | 1:3 | Yes/Yes | ||||
