- Packaging :
- Operating Temperature :
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- Voltage - Supply (Vcc/Vdd) :
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11 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
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3,950
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
|
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3,408
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
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2,139
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
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865
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
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3,620
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
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916
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
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3,418
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
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3,588
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | A/D 24x12b | Internal | ||||
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3,591
In-stock
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NXP USA Inc. | NXP 32-BIT MCU TRIPLE CORE 3MB | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | A/D 80x10b, 64x12b | Internal | ||||
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1,869
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU TRIPLE CORE 3MB | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | A/D 80x10b, 64x12b | Internal | ||||
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3,897
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU TRIPLE POWER ARC | Automotive, AEC-Q100 MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, LVD, POR, Zipwire | e200z4 | 150MHz | 3.5 V ~ 5.5 V | - | 192K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | A/D 12b SAR, 16b Sigma-Delta | Internal | ||||
