- Part Status :
- Packaging :
- Operating Temperature :
- Connectivity :
-
- 1-Wire, EBI/EMI, I²C, QSPI, SPI, UART/USART, USB (1)
- CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART (2)
- CAN, EBI/EMI, Ethernet, I²C, LIN, SPI (8)
- CAN, EBI/EMI, Ethernet, SCI, SPI (13)
- CAN, EBI/EMI, LIN, SCI, SPI (9)
- CAN, EBI/EMI, LIN, SCI, SPI, UART/USART (1)
- CAN, EBI/EMI, SCI, SPI (3)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (45)
- CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART (1)
- CAN, SCI, SPI (5)
- Oscillator Type :
- Applied Filters :
88 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
616
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,135
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,809
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
2,562
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
1,490
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,140
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,625
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
1,856
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,448
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,117
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,122
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
2,893
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
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2,635
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 112MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
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|
2,238
In-stock
|
NXP USA Inc. | 3M FLASH 256K RAM Z7 200MHZ | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
2,079
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
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2,907
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
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|
2,219
In-stock
|
NXP USA Inc. | 3M FLASH 256K RAM Z7 200MHZ | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
2,873
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
|
2,117
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
3,848
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
1,635
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
|
3,950
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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3,408
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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|
1,154
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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1,290
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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|
2,710
In-stock
|
NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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|
2,613
In-stock
|
NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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|
2,542
In-stock
|
NXP USA Inc. | 32 BITDUAL CORE3M FLASH384 RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,654
In-stock
|
NXP USA Inc. | 32 BITDUAL CORE3M FLASH512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
2,139
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
