- Packaging :
- Connectivity :
-
- ASC, CAN, EBI/EMI, FlexRay, MLI, MSC, SSC (2)
- ASC, CAN, FlexRay, MLI, MSC, SSC (1)
- CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART (11)
- CAN, EBI/EMI, Ethernet, SCI, SPI (11)
- CAN, EBI/EMI, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART (4)
- CAN, EBI/EMI, I²C, LIN, MibSPI, SCI, SPI, UART/USART (4)
- CAN, EBI/EMI, LIN, SCI, SPI (9)
- CAN, EBI/EMI, SCI, SPI (3)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI (13)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (39)
- CAN, Ethernet, I²C, LIN, SCI, SPI (16)
- CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART (1)
- CAN, I²C, LIN, SCI, SPI (8)
- CAN, SCI, SPI (5)
- EEPROM Size :
- Oscillator Type :
- Applied Filters :
127 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
RFQ |
2,063
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 144LQFP | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R | Obsolete | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 160MHz | 1.14 V ~ 3.6 V | 58 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
RFQ |
756
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R | Obsolete | Tray | -40°C ~ 125°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 180MHz | 1.14 V ~ 3.6 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
RFQ |
3,748
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 144LQFP | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R | Obsolete | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 160MHz | 1.14 V ~ 3.6 V | 58 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
RFQ |
1,982
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R | Obsolete | Tray | -40°C ~ 125°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 180MHz | 1.14 V ~ 3.6 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
616
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,135
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,809
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
2,562
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
1,490
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 144MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,140
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,856
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
2,448
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
1,122
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
2,893
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
2,635
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 112MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
2,238
In-stock
|
NXP USA Inc. | 3M FLASH 256K RAM Z7 200MHZ | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
2,079
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
2,907
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
2,219
In-stock
|
NXP USA Inc. | 3M FLASH 256K RAM Z7 200MHZ | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
2,873
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | ||||
|
2,117
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
2,429
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
1,445
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
1,442
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
1,549
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
|
2,206
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 208LQFP | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
849
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 256MAPBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
3,848
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | Internal | ||||
|
1,319
In-stock
|
NXP USA Inc. | 3M FLASH256K RAM120MHZ | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
3,523
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
