- Manufacture :
- Series :
- Packaging :
- Package / Case :
- Supplier Device Package :
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- Speed :
- Voltage - Supply (Vcc/Vdd) :
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9 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
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3,508
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324BGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | ||||
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2,477
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | ||||
|
RFQ |
1,591
In-stock
|
Infineon Technologies | 32 BIT AURIX | AURIX™ | Active | Digi-Reel® | -40°C ~ 125°C (TJ) | 292-LFBGA | PG-LFBGA-292-6 | DMA, WDT | TriCore™ | 200MHz | 1.17 V ~ 1.43 V, 2.97 V ~ 5.5 V | 78 | 192K x 8 | 32-Bit | CAN, FlexRay, LIN, QSPI | 2MB (2M x 8) | Flash | 128K x 8 | A/D 24x12b | External | |||
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3,024
In-stock
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Infineon Technologies | 32 BIT AURIX | AURIX™ | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 292-LFBGA | PG-LFBGA-292-6 | DMA, WDT | TriCore™ | 200MHz | 1.17 V ~ 1.43 V, 2.97 V ~ 5.5 V | 78 | 192K x 8 | 32-Bit | CAN, FlexRay, LIN, QSPI | 2MB (2M x 8) | Flash | 128K x 8 | A/D 24x12b | External | ||||
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|
910
In-stock
|
Infineon Technologies | 32 BIT AURIX | AURIX™ | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 292-LFBGA | PG-LFBGA-292-6 | DMA, WDT | TriCore™ | 200MHz | 1.17 V ~ 1.43 V, 2.97 V ~ 5.5 V | 78 | 192K x 8 | 32-Bit | CAN, FlexRay, LIN, QSPI | 2MB (2M x 8) | Flash | 128K x 8 | A/D 24x12b | External | ||||
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|
RFQ |
2,095
In-stock
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Infineon Technologies | 32 BIT AURIX | AURIX™ | Active | Digi-Reel® | -40°C ~ 125°C (TJ) | 144-TQFP Exposed Pad | PG-TQFP-144-27 | DMA, WDT | TriCore™ | 200MHz | 1.17 V ~ 1.43 V, 2.97 V ~ 5.5 V | 78 | 192K x 8 | 32-Bit | CAN, FlexRay, LIN, QSPI | 2MB (2M x 8) | Flash | 128K x 8 | A/D 24x12b | External | |||
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2,575
In-stock
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Infineon Technologies | 32 BIT AURIX | AURIX™ | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 144-TQFP Exposed Pad | PG-TQFP-144-27 | DMA, WDT | TriCore™ | 200MHz | 1.17 V ~ 1.43 V, 2.97 V ~ 5.5 V | 78 | 192K x 8 | 32-Bit | CAN, FlexRay, LIN, QSPI | 2MB (2M x 8) | Flash | 128K x 8 | A/D 24x12b | External | ||||
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3,394
In-stock
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Infineon Technologies | 32 BIT AURIX | AURIX™ | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 144-TQFP Exposed Pad | PG-TQFP-144-27 | DMA, WDT | TriCore™ | 200MHz | 1.17 V ~ 1.43 V, 2.97 V ~ 5.5 V | 78 | 192K x 8 | 32-Bit | CAN, FlexRay, LIN, QSPI | 2MB (2M x 8) | Flash | 128K x 8 | A/D 24x12b | External | ||||
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|
3,275
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tray | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | - | External | ||||
