- Part Status :
- Supplier Device Package :
-
- 100-LQFP (14x14) (41)
- 100-MAPBGA (11x11) (1)
- 100-TFBGA (9x9) (44)
- 100-VFBGA (7x7) (18)
- 144-LFBGA (10x10) (33)
- 144-LQFP (15x15) (3)
- 144-LQFP (20x20) (41)
- 144-TFBGA (10x10) (12)
- 144-UFBGA (6x6) (24)
- 176-LQFP (24x24) (3)
- 176-LQFP (26x26) (2)
- 216-TFBGA (13x13) (1)
- 257-MAPBGA (14x14) (2)
- 473-MAPBGA (19x19) (6)
- 64-LQFP (10x10) (18)
- 64-QFN (9x9) (8)
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Connectivity :
-
- CAN, CSIO, I²C, LIN, UART/USART (2)
- CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI (8)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (15)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (49)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SAI, SDIO, SPI, UART/USART, USB, USB OTG (2)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB (2)
- CAN, EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (8)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI (6)
- CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (16)
- CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (28)
- CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB (8)
- CAN, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (8)
- EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (40)
- I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (50)
- I²C, IrDA, LIN, SPI, UART/USART, USB (18)
- Program Memory Size :
- EEPROM Size :
- Applied Filters :
260 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
RFQ |
2,969
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 64LQFP | SAM S70 | Active | Tray | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 44 | 384K x 8 | 32-Bit | I²C, IrDA, LIN, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 5x12b, D/A 1x12b | Internal | |||
|
2,280
In-stock
|
NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | ||||
|
1,084
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | ||||
|
|
3,979
In-stock
|
NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | ||||
|
|
3,318
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | ||||
|
|
3,132
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | ||||
|
|
3,755
In-stock
|
NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | ||||
|
|
909
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | ||||
|
|
3,975
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
|
RFQ |
613
In-stock
|
Microchip Technology | IC MCU 32BIT 2MB FLASH 100TFBGA | SAM E70 | Discontinued at Digi-Key | Digi-Reel® | -40°C ~ 105°C (TA) | 100-UFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.62 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 2MB (2M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | |||
|
|
RFQ |
3,884
In-stock
|
Microchip Technology | IC MCU 32BIT 2MB FLASH 100TFBGA | SAM E70 | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 105°C (TA) | 100-UFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.62 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 2MB (2M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | |||
|
|
1,535
In-stock
|
Microchip Technology | IC MCU 32BIT 2MB FLASH 100TFBGA | SAM E70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-UFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.62 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 2MB (2M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | ||||
|
RFQ |
1,437
In-stock
|
Microchip Technology | IC MCU 32BIT 2MB FLASH 144LQFP | SAM S70 | Discontinued at Digi-Key | Digi-Reel® | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 114 | 384K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 2MB (2M x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | |||
|
|
RFQ |
2,112
In-stock
|
Microchip Technology | IC MCU 32BIT 2MB FLASH 144LQFP | SAM S70 | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 114 | 384K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 2MB (2M x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | |||
|
|
3,077
In-stock
|
Microchip Technology | IC MCU 32BIT 2MB FLASH 144LQFP | SAM S70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 114 | 384K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 2MB (2M x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | ||||
|
|
RFQ |
2,734
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 100TFBGA | SAM E70 | Discontinued at Digi-Key | Digi-Reel® | -40°C ~ 105°C (TA) | 100-UFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.62 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | |||
|
|
RFQ |
3,735
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 100TFBGA | SAM E70 | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 105°C (TA) | 100-UFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.62 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | |||
|
|
2,826
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 100TFBGA | SAM E70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-UFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.62 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | ||||
|
|
1,616
In-stock
|
Microchip Technology | IC MCU 32BIT 2MB FLASH 64LQFP | SAM S70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 44 | 384K x 8 | 32-Bit | I²C, IrDA, LIN, SPI, UART/USART, USB | 2MB (2M x 8) | Flash | - | A/D 5x12b, D/A 1x12b | Internal | ||||
|
|
RFQ |
3,996
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 144LQFP | SAM S70 | Discontinued at Digi-Key | Digi-Reel® | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 114 | 384K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | |||
|
|
RFQ |
2,336
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 144LQFP | SAM S70 | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 114 | 384K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | |||
|
|
1,023
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 144LQFP | SAM S70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 114 | 384K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | ||||
|
RFQ |
2,490
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 100LQFP | SAM S70 | Discontinued at Digi-Key | Digi-Reel® | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | |||
|
|
RFQ |
3,925
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 100LQFP | SAM S70 | Discontinued at Digi-Key | Cut Tape (CT) | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | |||
|
|
3,631
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 100LQFP | SAM S70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 75 | 384K x 8 | 32-Bit | I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 10x12b, D/A 2x12b | Internal | ||||
|
|
2,943
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
|
|
3,886
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
|
|
3,978
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
|
|
1,595
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384 RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
|
|
936
In-stock
|
NXP USA Inc. | SINGLE CORE 3M FLASH 384 RAM | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
