- Part Status :
- Packaging :
- Supplier Device Package :
-
- 100-LQFP (14x14) (1)
- 100-MAPBGA (11x11) (1)
- 140-WLP (4.47x4.43) (1)
- 144-LQFP (20x20) (11)
- 176-LFQFP (24x24) (1)
- 176-LQFP (24x24) (24)
- 208-LQFP (28x28) (4)
- 208-TQFP (28x28) (4)
- 256-LBGA (17x17) (1)
- 256-MAPBGA (8)
- 256-MAPPBGA (17x17) (1)
- 337-NFBGA (16x16) (10)
- 416-PBGA (27x27) (3)
- 516-MAPBGA (27x27) (4)
- Voltage - Supply (Vcc/Vdd) :
- Connectivity :
-
- 1-Wire, EBI/EMI, I²C, QSPI, SPI, UART/USART, USB (1)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB (3)
- CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART (4)
- CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB (10)
- CAN, EBI/EMI, Ethernet, I²C, LIN, SCI, SPI, USB (2)
- CAN, EBI/EMI, Ethernet, I²C, LIN, SPI (8)
- CAN, EBI/EMI, Ethernet, SCI, SPI (2)
- CAN, EBI/EMI, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB (4)
- CAN, EBI/EMI, LIN, SCI, SPI, UART/USART (1)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI (6)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (5)
- CAN, Ethernet, I²C, LIN, SCI, SPI (20)
- CAN, I²C, LIN, SCI, SPI (8)
- CAN, LIN, SPI, UART/USART (2)
- Oscillator Type :
- Applied Filters :
76 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
|
RFQ |
1,756
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 220MHz | 1.14 V ~ 1.32 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
RFQ |
3,530
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 144LQFP | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 220MHz | 1.14 V ~ 1.32 V | 64 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
2,080
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Hercules™ RM4 ARM® Cortex®-R4 | Discontinued at Digi-Key | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, SCI, SPI, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
3,779
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 144LQFP | Hercules™ RM4 ARM® Cortex®-R4 | Discontinued at Digi-Key | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 64 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, SCI, SPI, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
1,998
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
864
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
2,742
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 337NFBGA | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (16x16) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 120 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
3,278
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 144LQFP | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 64 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
901
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 144LQFP | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 64 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
|
RFQ |
1,101
In-stock
|
Texas Instruments | IC MCU 32BIT 3MB FLASH 144LQFP | Hercules™ RM4 ARM® Cortex®-R4 | Obsolete | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, POR, PWM, WDT | ARM® Cortex®-R4F | 200MHz | 1.14 V ~ 1.32 V | 64 | 256K x 8 | 16/32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, SPI, UART/USART, USB | 3MB (3M x 8) | Flash | 64K x 8 | A/D 24x12b | External | |||
|
1,625
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,117
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 40x12b | External | ||||
|
|
2,925
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
|
2,568
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
|
1,343
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
|
1,845
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
|
2,931
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
|
1,777
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 177 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
|
|
3,950
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
3,408
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
1,154
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
2,139
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
865
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
3,620
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
916
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
2,123
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,694
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
|
|
3,418
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
3,588
In-stock
|
NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | ||||
|
|
3,778
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
