- Manufacture :
- Series :
- Packaging :
- Operating Temperature :
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35 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
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849
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 256MAPBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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1,319
In-stock
|
NXP USA Inc. | 3M FLASH256K RAM120MHZ | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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3,523
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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1,343
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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1,845
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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2,931
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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2,565
In-stock
|
NXP USA Inc. | 3M FLASH256K RAM120MHZ | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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3,990
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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2,710
In-stock
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,613
In-stock
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,542
In-stock
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NXP USA Inc. | 32 BITDUAL CORE3M FLASH384 RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,698
In-stock
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NXP USA Inc. | 32 BIT3M FLASH512K RAM | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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1,454
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,131
In-stock
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NXP USA Inc. | 32 BITDUAL CORE3M FLASH384 RA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,263
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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1,286
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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807
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,556
In-stock
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NXP USA Inc. | DUAL CORE, 3M FLASH, 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,040
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,175
In-stock
|
NXP USA Inc. | IC MCU 32BIT 3MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,551
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,549
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,184
In-stock
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STMicroelectronics | IC MCU 32BIT 3MB FLASH 256LBGA | SPC56 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-LBGA (17x17) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 199 | 192K x 8 | 32-Bit | CAN, LIN, SPI, UART/USART | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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3,747
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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720
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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735
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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1,146
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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1,621
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 3MB | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 199 | 192K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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2,852
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 3MB | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 199 | 192K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
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1,802
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPBGA | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 199 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 33x10b, 10x12b | Internal | ||||
