- Series :
- Packaging :
- Operating Temperature :
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- Supplier Device Package :
- Peripherals :
- RAM Size :
- Core Size :
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17 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||
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889
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tray | -40°C ~ 105°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 25MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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1,573
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 20MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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1,319
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 20MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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1,283
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 20MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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2,174
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 25MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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1,668
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 25MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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738
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 20MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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2,711
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 160QFP | M683xx | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 160-BQFP | 160-QFP (28x28) | POR, PWM, WDT | CPU32 | 20MHz | 4.75 V ~ 5.25 V | 18 | 7.5K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | - | ROMless | - | A/D 16x10b | External | ||||
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3,705
In-stock
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NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | POR, WDT | HC11 | 4MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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2,505
In-stock
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NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | POR, WDT | HC11 | 3MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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2,861
In-stock
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NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | POR, WDT | HC11 | 2MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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3,096
In-stock
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NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tube | -40°C ~ 105°C (TA) | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) | POR, WDT | HC11 | 4MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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1,274
In-stock
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NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tube | -40°C ~ 105°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | POR, WDT | HC11 | 3MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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1,669
In-stock
|
NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) | POR, WDT | HC11 | 4MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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609
In-stock
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NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tube | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | POR, WDT | HC11 | 3MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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1,210
In-stock
|
NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tube | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | POR, WDT | HC11 | 2MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
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2,107
In-stock
|
NXP USA Inc. | IC MCU 8BIT ROMLESS 68PLCC | HC11 | Not For New Designs | Tube | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | POR, WDT | HC11 | 4MHz | 4.75 V ~ 5.25 V | 30 | 1K x 8 | 8-Bit | SCI, SPI | - | ROMless | 512 x 8 | A/D 8x8b | Internal | ||||
