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42 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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3,021
In-stock
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Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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2,639
In-stock
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Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,174
In-stock
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Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,162
In-stock
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Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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RFQ |
3,929
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | |||
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1,609
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,235
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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RFQ |
3,511
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | |||
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2,867
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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1,252
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,290
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,188
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN S | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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2,434
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN U | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,818
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN C | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,207
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN S | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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926
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN U | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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1,683
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN C | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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RFQ |
1,843
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN SEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | |||
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1,523
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN SEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,574
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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RFQ |
3,697
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN UEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | |||
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1,098
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN UEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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1,078
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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RFQ |
1,337
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN SEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | |||
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741
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN SEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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1,872
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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2,627
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN UEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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1,061
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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1,107
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN SEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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1,766
In-stock
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Microchip Technology | PROD FF IND SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
