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59 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | RAM Size | Program Memory Type | Controller Series | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
RFQ |
1,904
In-stock
|
Microchip Technology | IC CRYPTO TPM 40QFN | - | Active | - | 0°C ~ 70°C | - | Trusted Platform Module (TPM) | - | I²C | - | 3.3V | AVR | 4 | - | - | - | |||
|
|
3,931
In-stock
|
Cypress Semiconductor Corp | IC USB 2.0 HUB 2-PORT 68QFN | HX3 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | USB 2.0 Hub Controller | 68-VFQFN Exposed Pad | I²C | 68-QFN (8x8) | 1.14 V ~ 1.26 V | ARM® Cortex®-M0 | 10 | 16K x 8 | ROM (32 kB) | CYUSB | ||||
|
|
2,714
In-stock
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | - | -20°C ~ 85°C | - | Embedded Security Trusted Computing | - | I²C | - | 1.8V, 3.3V | 16-Bit | - | - | - | - | |||||
|
RFQ |
2,903
In-stock
|
NXP USA Inc. | AU10TICS | - | Active | Digi-Reel® | -25°C ~ 90°C (TA) | Surface Mount | Authentication | 8-VDFN Exposed Pad | I²C | 8-HVSON (4x4) | 2.5 V ~ 3.6 V | MX51 | - | - | - | - | |||
|
|
3,573
In-stock
|
NXP USA Inc. | AU10TICS | - | Active | Cut Tape (CT) | -25°C ~ 90°C (TA) | Surface Mount | Authentication | 8-VDFN Exposed Pad | I²C | 8-HVSON (4x4) | 2.5 V ~ 3.6 V | MX51 | - | - | - | - | ||||
|
|
2,560
In-stock
|
NXP USA Inc. | AU10TICS | - | Active | Tape & Reel (TR) | -25°C ~ 90°C (TA) | Surface Mount | Authentication | 8-VDFN Exposed Pad | I²C | 8-HVSON (4x4) | 2.5 V ~ 3.6 V | MX51 | - | - | - | - | ||||
|
3,310
In-stock
|
Cypress Semiconductor Corp | IC USB 2.0 HUB 4-PORT 68QFN | HX3 | Active | Tray | -40°C ~ 85°C | Surface Mount | USB 2.0 Hub Controller | 68-VFQFN Exposed Pad | I²C | 68-QFN (8x8) | 1.14 V ~ 1.26 V | ARM® Cortex®-M0 | 10 | 16K x 8 | ROM (32 kB) | CYUSB | ||||
|
|
3,672
In-stock
|
Cypress Semiconductor Corp | IC USB 3.0 HUB 2-PORT 68QFN | HX3 | Active | Tray | -40°C ~ 85°C | Surface Mount | USB 3.0 Hub Controller | 68-VFQFN Exposed Pad | I²C | 68-QFN (8x8) | 1.14 V ~ 1.26 V | ARM® Cortex®-M0 | 10 | 16K x 8 | ROM (32 kB) | CYUSB | ||||
|
|
3,774
In-stock
|
Cypress Semiconductor Corp | IC USB 3.0 HUB 2-PORT 68QFN | HX3 | Active | Tray | 0°C ~ 70°C | Surface Mount | USB 3.0 Hub Controller | 68-VFQFN Exposed Pad | I²C | 68-QFN (8x8) | 1.14 V ~ 1.26 V | ARM® Cortex®-M0 | 10 | 16K x 8 | ROM (32 kB) | CYUSB | ||||
|
|
2,095
In-stock
|
Cypress Semiconductor Corp | IC USB 2.0 HUB 2-PORT 68QFN | HX3 | Active | Tray | -40°C ~ 85°C | Surface Mount | USB 2.0 Hub Controller | 68-VFQFN Exposed Pad | I²C | 68-QFN (8x8) | 1.14 V ~ 1.26 V | ARM® Cortex®-M0 | 10 | 16K x 8 | ROM (32 kB) | CYUSB | ||||
|
RFQ |
3,929
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
1,609
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | ||||
|
|
3,235
In-stock
|
Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | ||||
|
|
RFQ |
3,511
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | |||
|
|
2,867
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | ||||
|
|
1,252
In-stock
|
Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | ||||
|
RFQ |
2,980
In-stock
|
Microchip Technology | FF IND I2C TPM 4.4MM TSSOP SEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | |||
|
|
3,026
In-stock
|
Microchip Technology | FF IND I2C TPM 4.4MM TSSOP SEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
|
1,366
In-stock
|
Microchip Technology | FF IND I2C TPM 4.4MM TSSOP SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
|
RFQ |
838
In-stock
|
Microchip Technology | FF IND I2C TPM 4.4MM TSSOP UEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | |||
|
|
1,622
In-stock
|
Microchip Technology | FF IND I2C TPM 4.4MM TSSOP UEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
|
1,999
In-stock
|
Microchip Technology | FF IND I2C TPM 4.4MM TSSOP UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
|
RFQ |
1,594
In-stock
|
Microchip Technology | FF COM I2C TPM 4.4MM TSSOP SEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | |||
|
|
1,223
In-stock
|
Microchip Technology | FF COM I2C TPM 4.4MM TSSOP SEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
|
2,194
In-stock
|
Microchip Technology | FF COM I2C TPM 4.4MM TSSOP SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
|
RFQ |
1,484
In-stock
|
Microchip Technology | FF COM I2C TPM 4.4MM TSSOP UEK | - | Active | Digi-Reel® | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | |||
|
|
2,773
In-stock
|
Microchip Technology | FF COM I2C TPM 4.4MM TSSOP UEK | - | Active | Cut Tape (CT) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
|
894
In-stock
|
Microchip Technology | FF COM I2C TPM 4.4MM TSSOP UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | - | ||||
|
2,857
In-stock
|
Cypress Semiconductor Corp | IC USB 3.0 HUB 2-PORT 68QFN | HX3 | Active | Tray | -40°C ~ 85°C | Surface Mount | USB 3.0 Hub Controller | 88-TFQFN Exposed Pad | I²C | 88-QFN (10x10) | 1.14 V ~ 1.26 V | ARM® Cortex®-M0 | 10 | 16K x 8 | ROM (32 kB) | CYUSB | ||||
|
|
3,188
In-stock
|
Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN S | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | - | ||||
