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22 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | Program Memory Type | |
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GLOBAL STOCKS | ||||||||||||||||||||
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807
In-stock
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Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | |||||
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1,321
In-stock
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Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | |||||
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3,021
In-stock
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Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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2,639
In-stock
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Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,174
In-stock
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Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,162
In-stock
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Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,290
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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1,107
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN SEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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1,766
In-stock
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Microchip Technology | PROD FF IND SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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2,934
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN UEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,205
In-stock
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Microchip Technology | PROD FF IND SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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2,931
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN CEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,539
In-stock
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Microchip Technology | PROD FF COM SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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2,256
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN SEK - | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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1,249
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN UEK - | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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1,305
In-stock
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Microchip Technology | PROD FF COM SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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2,318
In-stock
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Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,092
In-stock
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Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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2,570
In-stock
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Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,768
In-stock
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Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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1,239
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | ||||
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3,094
In-stock
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - |