- Manufacture :
- Series :
- Operating Temperature :
- Package / Case :
-
- 100-BQFP (2)
- 100-LQFP (4)
- 1020-BGA (3)
- 1024-BGA (3)
- 1152-BGA (2)
- 128-BFQFP (4)
- 128-LQFP (12)
- 128-TQFP (16)
- 1369-BGA (3)
- 14-SOIC (0.154", 3.90mm Width) (4)
- 144-BGA (2)
- 144-LBGA (2)
- 144-LQFP (2)
- 16-SOIC (0.295", 7.50mm Width) (2)
- 160-BQFP (2)
- 20-LCC (J-Lead) (3)
- 20-TSSOP (0.173", 4.40mm Width) (3)
- 200-LFBGA (1)
- 208-BGA (2)
- 208-LBGA (2)
- 220-LBGA (2)
- 225-BGA (4)
- 256-BGA (11)
- 256-LBGA (1)
- 256-LBGA Exposed Pad (8)
- 256-LBGA, CSBGA (7)
- 272-BBGA (3)
- 28-SOIC (0.295", 7.50mm Width) (3)
- 28-VFQFN Exposed Pad (2)
- 30-Stik Module (1)
- 300-BBGA (9)
- 316-BGA (2)
- 32-LCC (J-Lead) (2)
- 349-BBGA, CSBGA Exposed Pad (2)
- 349-BGA Exposed Pad (2)
- 40-VFQFN Exposed Pad (1)
- 42-WFQFN Exposed Pad (28)
- 420-BBGA (2)
- 44-LCC (J-Lead) (13)
- 44-LQFP (4)
- 44-TQFP (8)
- 48-QFN (4)
- 48-VFQFN Exposed Pad (3)
- 480-LBGA (1)
- 484-BGA (2)
- 49-LFBGA, CSPBGA (5)
- 56-VFQFN Exposed Pad (2)
- 64-LQFP (2)
- 64-QFP (1)
- 672-BGA (2)
- 68-VFQFN Exposed Pad (1)
- 80-LQFP (7)
- Interface :
- Supplier Device Package :
-
- 100-LQFP (16x16) (2)
- 100-QFP (14x20) (2)
- 100-TQFP (14x14) (2)
- 1020-FCBGA (33x33) (2)
- 1020-UPBGA (1)
- 1024-BGA (33x33) (3)
- 1152-UPBGA (2)
- 128-LQFP (14x20) (12)
- 128-PQFP (14x20) (4)
- 1369-BGA (37.5x37.5) (3)
- 14-SOIC (4)
- 144-BGA (13x13) (2)
- 144-LQFP (20x20) (2)
- 144-PBGA (13x13) (2)
- 16-SOIC (6)
- 160-PQFP (28x28) (2)
- 176-LQFP (2)
- 20-PLCC (9x9) (3)
- 20-TSSOP (3)
- 208-PBGA (17x17) (2)
- 208-STBGA (17x17) (2)
- 220-LBGA (17x17) (2)
- 225-BGA (19x19) (4)
- 256-BGA (27x27) (11)
- 256-CSBGA (17x17) (7)
- 256-PBGA (27x27) (8)
- 272-PBGA (27x27) (3)
- 28-QFN (2)
- 28-SOIC (3)
- 300-PBGA (27x27) (9)
- 302-TQFP (24x24) (1)
- 32-PLCC (11.43x13.97) (2)
- 349-HS-CSBGA (27x27) (2)
- 349-TE-PBGA-2 (27x27) (2)
- 40-QFN (6x6) (1)
- 42-QFN (5x7) (28)
- 420-PBGA (2)
- 44-PLCC (16.59x16.59) (12)
- 44-TQFP (10x10) (4)
- 48-LQFP (10)
- 48-LQFP (7x7) (2)
- 48-QFN (6x6) (3)
- 480-TBGA (37.5x37.5) (1)
- 484-STBGA (23x23) (2)
- 49-CSBGA (7x7) (5)
- 56-QFN (7x7) (1)
- 56-QFN-EP (7x7) (1)
- 64-TQFP (10x10) (2)
- 672-TEPBGA (27x27) (2)
- 68-QFN (8x8) (1)
- 80-LQFP (12x12) (1)
- 80-TQFP (14x14) (6)
- P-64-MQFP (1)
- P-LCC-44 (1)
- PG-LBGA-256 (1)
- PG-LFBGA-200 (1)
- Applied Filters :
222 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Interface | Supplier Device Package | Number of Circuits | Voltage - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
RFQ |
2,965
In-stock
|
NXP USA Inc. | IC VOIP PROCESSOR 4CH 672BGA | Obsolete | Bulk | - | - | Surface Mount | 672-BGA | - | 672-TEPBGA (27x27) | - | - | ||||
|
|
RFQ |
2,714
In-stock
|
NXP USA Inc. | IC VOIP PROCESSOR 8CH 672BGA | Obsolete | Bulk | - | - | Surface Mount | 672-BGA | - | 672-TEPBGA (27x27) | - | - | ||||
|
RFQ |
3,538
In-stock
|
NXP USA Inc. | IC HDLC 40-CH 480-TBGA | - | Obsolete | Tray | - | 0°C ~ 85°C | Surface Mount | 480-LBGA | IEEE 1149.1 | 480-TBGA (37.5x37.5) | - | 3.15 V ~ 3.45 V | |||
|
RFQ |
3,741
In-stock
|
Exar Corporation | IC LIU E1 7CH 3.3V 100TQFP | - | Obsolete | Bulk | - | -40°C ~ 75°C | Surface Mount | 100-LQFP | LIU | 100-TQFP (14x14) | 7 | 3.135 V ~ 3.465 V | |||
|
RFQ |
2,143
In-stock
|
Exar Corporation | IC LIU E1 QUAD 80TQFP | - | Obsolete | Bulk | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | LIU | 80-TQFP (14x14) | - | 4.75 V ~ 5.25 V | |||
|
RFQ |
3,067
In-stock
|
Maxim Integrated | IC PLC MODEM OFDM BASED | - | Active | Tape & Reel (TR) | 7.4mA | -40°C ~ 85°C | Surface Mount | 48-LQFP | UART | 48-LQFP (7x7) | 1 | 2.7 V ~ 3.6 V | |||
|
|
RFQ |
2,633
In-stock
|
Maxim Integrated | IC PLC MODEM OFDM BASED | - | Active | Tray | 7.4mA | -40°C ~ 85°C | Surface Mount | 48-LQFP | UART | 48-LQFP (7x7) | 1 | 2.7 V ~ 3.6 V | |||
|
RFQ |
2,616
In-stock
|
Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256-BGA | - | Obsolete | Tray | 275mA | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | WAN | 256-CSBGA (17x17) | 8 | 3.135 V ~ 3.465 V | |||
|
RFQ |
867
In-stock
|
Maxim Integrated | IC MUX T3/E3 3.3V 256BGA | - | Obsolete | Tray | 150mA | 0°C ~ 70°C | Surface Mount | 256-BGA | Parallel/Serial | 256-PBGA (27x27) | - | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
3,932
In-stock
|
Maxim Integrated | IC MUX T3/E3 3.3V 256BGA | - | Obsolete | Tray | 150mA | 0°C ~ 70°C | Surface Mount | 256-BGA | Parallel/Serial | 256-PBGA (27x27) | - | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
740
In-stock
|
IDT, Integrated Device Technology Inc | IC FRAMER T1/J1/E1 8CH 128QFP | - | Obsolete | Tape & Reel (TR) | 160mA | -40°C ~ 85°C | Surface Mount | 128-BFQFP | Parallel | 128-PQFP (14x20) | 8 | 2.97 V ~ 3.63 V | |||
|
|
RFQ |
2,370
In-stock
|
IDT, Integrated Device Technology Inc | IC FRAMER T1/J1/E1 8CH 128QFP | - | Obsolete | Tray | 160mA | -40°C ~ 85°C | Surface Mount | 128-BFQFP | Parallel | 128-PQFP (14x20) | 8 | 2.97 V ~ 3.63 V | |||
|
|
RFQ |
2,552
In-stock
|
IDT, Integrated Device Technology Inc | IC FRAMER T1/J1/E1 8CH 144-BGA | - | Obsolete | Tray | 160mA | -40°C ~ 85°C | Surface Mount | 144-BGA | Parallel | 144-PBGA (13x13) | 8 | 2.97 V ~ 3.63 V | |||
|
|
RFQ |
2,877
In-stock
|
IDT, Integrated Device Technology Inc | IC FRAMER T1/J1/E1 8CH 144-BGA | - | Discontinued at Digi-Key | Tray | 160mA | -40°C ~ 85°C | Surface Mount | 144-BGA | Parallel | 144-PBGA (13x13) | 8 | 2.97 V ~ 3.63 V | |||
|
RFQ |
1,845
In-stock
|
IDT, Integrated Device Technology Inc | IC LIU T1/J1/E1 1CH 44-TQFP | - | Obsolete | Tape & Reel (TR) | - | - | Surface Mount | 44-LQFP | - | 44-TQFP (10x10) | - | 3.13 V ~ 3.47 V | |||
|
|
RFQ |
2,858
In-stock
|
IDT, Integrated Device Technology Inc | IC LIU T1/J1/E1 1CH 44-TQFP | - | Obsolete | Tray | - | - | Surface Mount | 44-LQFP | - | 44-TQFP (10x10) | - | 3.13 V ~ 3.47 V | |||
|
RFQ |
3,922
In-stock
|
IDT, Integrated Device Technology Inc | IC LIU T1/E1 8CH SHORT 208-BGA | - | Obsolete | Tray | - | -40°C ~ 85°C | Surface Mount | 208-BGA | LIU | 208-PBGA (17x17) | - | 3.13 V ~ 3.47 V | |||
|
|
RFQ |
2,635
In-stock
|
IDT, Integrated Device Technology Inc | IC TXRX SGL T1/E1/J1 80TQFP | - | Obsolete | Tape & Reel (TR) | 1.15A | -40°C ~ 85°C | Surface Mount | 80-LQFP | SPI | 80-TQFP (14x14) | 1 | 3 V ~ 3.6 V | |||
|
|
RFQ |
1,297
In-stock
|
IDT, Integrated Device Technology Inc | IC TXRX SGL T1/E1/J1 80TQFP | - | Obsolete | Tray | 1.15A | -40°C ~ 85°C | Surface Mount | 80-LQFP | SPI | 80-TQFP (14x14) | 1 | 3 V ~ 3.6 V | |||
|
|
RFQ |
3,186
In-stock
|
IDT, Integrated Device Technology Inc | IC LINE INTERFACE UNIT 208BGA | - | Obsolete | Tray | - | -40°C ~ 85°C | Surface Mount | 208-BGA | LIU | 208-PBGA (17x17) | - | 3.13 V ~ 3.47 V | |||
|
RFQ |
3,655
In-stock
|
Cypress Semiconductor Corp | IC TXRX HOTLINK II QUAD 256LBGA | HOTlink II™ | Obsolete | Tray | - | - | Surface Mount | 256-LBGA Exposed Pad | - | 256-BGA (27x27) | 4 | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
3,150
In-stock
|
Cypress Semiconductor Corp | IC TXRX HOTLINK II QUAD 256LBGA | HOTlink II™ | Obsolete | Tray | - | - | Surface Mount | 256-LBGA Exposed Pad | - | 256-BGA (27x27) | 4 | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
3,116
In-stock
|
Cypress Semiconductor Corp | IC RECLOCKER HOTLINK II 256LBGA | HOTlink II™ | Obsolete | Tray | 900mA | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | LVTTL | 256-BGA (27x27) | 4 | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
1,976
In-stock
|
Cypress Semiconductor Corp | IC SERDES HOTLINK II 256LBGA | HOTlink II™ | Obsolete | Tray | 830mA | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | LVTTL | 256-BGA (27x27) | 4 | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
2,144
In-stock
|
Cypress Semiconductor Corp | IC SERDES HOTLINK II 256LBGA | HOTlink II™ | Obsolete | Tray | 830mA | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | LVTTL | 256-BGA (27x27) | 4 | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
3,659
In-stock
|
Cypress Semiconductor Corp | IC SERDES HOTLINK 256LBGA | HOTlink II™ | Obsolete | Tray | 830mA | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | LVTTL | 256-BGA (27x27) | 4 | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
1,260
In-stock
|
Cypress Semiconductor Corp | IC SERDES HOTLINK 256LBGA | HOTlink II™ | Obsolete | Tray | 830mA | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | LVTTL | 256-BGA (27x27) | 4 | 3.135 V ~ 3.465 V | |||
|
|
RFQ |
3,466
In-stock
|
Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256BGA | - | Obsolete | Tray | 275mA | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | WAN | 256-CSBGA (17x17) | 8 | 3.135 V ~ 3.465 V | |||
|
RFQ |
766
In-stock
|
Maxim Integrated | IC FRAMER 4X4 16CH 300-BGA | - | Obsolete | Tray | 225mA | -40°C ~ 85°C | Surface Mount | 300-BBGA | Parallel/Serial | 300-PBGA (27x27) | - | 2.97 V ~ 3.63 V | |||
|
|
RFQ |
2,083
In-stock
|
Maxim Integrated | IC FRAMER 4X4 16CH 300-BGA | - | Obsolete | Tray | 225mA | 0°C ~ 70°C | Surface Mount | 300-BBGA | Parallel/Serial | 300-PBGA (27x27) | - | 2.97 V ~ 3.63 V | |||
