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26 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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3,184
In-stock
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Leader Tech Inc. | 0.07 X .25 X 045 SNPB 24--7-21C- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.250" (6.35mm) | Lead, Tin | Flash | Adhesive | ||||
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2,989
In-stock
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Leader Tech Inc. | .250" X 50' LONG TECHMESH TAPE-- | - | Active | - | - | Gasket Sleeve | - | - | - | 0.250" (6.35mm) | Tin | - | - | ||||
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3,666
In-stock
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Leader Tech Inc. | .250"W X .250"H X 6.75"L--SQUARE | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | - | 0.250" (6.35mm) | 6.750" (171.45mm) | 0.250" (6.35mm) | - | - | - | ||||
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2,321
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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716
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USFT | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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1,811
In-stock
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Leader Tech Inc. | 0.07 X .25 X 045 CDC 16--7-21C-0 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Cadmium + Clear Chromate | Flash | Adhesive | ||||
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2,145
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 6.35X406.4MM | - | Active | - | - | - | - | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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2,883
In-stock
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Laird Technologies EMI | FINGERSTCK ULTRASFT 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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1,964
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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683
In-stock
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Leader Tech Inc. | 8000 SERIES-ORIENTED WIRE--8200- | - | Active | Conductive Elastomer | -62°C ~ 260°C | Gasket | - | 0.062" (1.57mm) | - | 0.250" (6.35mm) | - | - | - | ||||
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1,078
In-stock
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Leader Tech Inc. | 0.08 X 0.25 BD 400--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 33.33 (10.16m) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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2,619
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,503
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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851
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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715
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,090
In-stock
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Laird Technologies EMI | NOSG COIL NIB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,688
In-stock
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Laird Technologies EMI | NOSG COIL ZNY PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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3,642
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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3,616
In-stock
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Laird Technologies EMI | NOSG,STR,BF | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||||
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3,976
In-stock
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Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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2,495
In-stock
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Leader Tech Inc. | 0.07 X .25 X 045 NI 16--7-21C-04 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | Flash | Adhesive | ||||
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2,894
In-stock
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Leader Tech Inc. | 0.07 X .25 X 045 SN 16--7-21C-04 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | Flash | Adhesive | ||||
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2,797
In-stock
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Leader Tech Inc. | 0.08 X 0.25 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | Flash | Adhesive | ||||
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2,019
In-stock
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Leader Tech Inc. | 0.07 X .25 X 045 BD 16--7-21C-04 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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2,520
In-stock
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Leader Tech Inc. | .093"T X .250"W--8200-0050-81 | - | Active | Conductive Elastomer | -62°C ~ 260°C | Gasket | - | 0.093" (2.36mm) | - | 0.250" (6.35mm) | - | - | - | ||||
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2,823
In-stock
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Laird Technologies EMI | GASKET BECU ALLOY 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||||
