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45 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||
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1,902
In-stock
|
Laird Technologies EMI | AP,STR,CDC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Cadmium + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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732
In-stock
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Laird Technologies EMI | AP,STR,SU,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
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2,005
In-stock
|
Laird Technologies EMI | AP,COIL,BF,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
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1,441
In-stock
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Leader Tech Inc. | 0.23 X 0.60 BD 3--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.230" (5.84mm) | 3.000" (76.20mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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3,509
In-stock
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Laird Technologies EMI | GASKET BECU 15.24X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.120" (3.05mm) | 0.347" (8.81mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
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2,889
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.120" (3.05mm) | 0.347" (8.81mm) | 0.600" (15.24mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,292
In-stock
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Laird Technologies EMI | NOSG,STR,SNSAT,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,813
In-stock
|
Leader Tech Inc. | 0.23 X 0.60 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
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3,579
In-stock
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Laird Technologies EMI | HDWE GROUNDING STRIP | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,677
In-stock
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Leader Tech Inc. | 0.22 X 0.60 BD 16--22-S-60AH-BD- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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1,024
In-stock
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Leader Tech Inc. | 0.12 X 0.60 BD 16--12-60LPAH-BD- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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3,821
In-stock
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Leader Tech Inc. | 0.22 X 0.60 NI 16--22-60RH-NI-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Nickel | Flash | Adhesive | ||||
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3,751
In-stock
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Leader Tech Inc. | 0.22 X 0.60 BD 16 NTP--22-60AH-B | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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3,496
In-stock
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Leader Tech Inc. | 0.22 X 0.60 BD 16--22-60AH-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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3,290
In-stock
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Laird Technologies EMI | GASKET BECU 15.24X6.35MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
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646
In-stock
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Laird Technologies EMI | GASKET BECU 15.24X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,316
In-stock
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Laird Technologies EMI | GASKET BECU 15.24X609.60MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
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3,006
In-stock
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Laird Technologies EMI | GASKET BECU ALLOY 15.24X609.6MM | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
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2,246
In-stock
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Leader Tech Inc. | 0.23 X 0.60 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.230" (5.84mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
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3,657
In-stock
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Leader Tech Inc. | 0.22 X 0.62 BD 15--22-S-62DTS-BD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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2,470
In-stock
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Leader Tech Inc. | 0.22 X 0.60 BD 16--22-60RH-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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2,949
In-stock
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Laird Technologies EMI | GASKET BECU 15.24X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
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RFQ |
1,237
In-stock
|
Leader Tech Inc. | 0.23 X 0.60 BD 24--FOLDED SERIES | - | Obsolete | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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1,918
In-stock
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Leader Tech Inc. | 0.23 X 0.60 BD 400--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.230" (5.84mm) | 33.33 (10.16m) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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2,250
In-stock
|
Laird Technologies EMI | AP COIL BF USFT PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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3,989
In-stock
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Laird Technologies EMI | AP COIL SNB PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,156
In-stock
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Leader Tech Inc. | 0.22 X 0.60 BD 16--22-S-60AF-BD- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
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1,500
In-stock
|
Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,331
In-stock
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Laird Technologies EMI | AP,STR,ZNC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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3,555
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive |