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26 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
3,051
In-stock
|
Leader Tech Inc. | 0.04 X 0.34 NI 16--4-34D-NI-16-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.040" (1.02mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Nickel | Flash | Adhesive | ||||
|
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1,882
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 070 BD 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
|
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3,303
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 065 BD 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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3,143
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 050 DL BD 16--10-3 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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758
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 045 DL BD 16--10-3 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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3,004
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 070 BD 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
|
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1,951
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 065 BD 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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3,563
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 050 BD 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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661
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 0.045 BD 16--10-30 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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3,912
In-stock
|
Leader Tech Inc. | 0.07 X 0.30 NI 24--6-30T-NI-24-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Nickel | Flash | Adhesive | ||||
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3,454
In-stock
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Leader Tech Inc. | 0.07 X 0.30 SN 24--6-30T-SN-24-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
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926
In-stock
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Laird Technologies EMI | FINGRSTOCK BECU ALY 7.57X609.6MM | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | Adhesive | ||||
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3,260
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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3,592
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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3,415
In-stock
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Laird Technologies EMI | TWT,STR,ZNC,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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896
In-stock
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Laird Technologies EMI | TWT,STR,SNSAT,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,665
In-stock
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Laird Technologies EMI | TWT,STR,NIB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,280
In-stock
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Laird Technologies EMI | TWT,STR,SNB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,254
In-stock
|
Laird Technologies EMI | TWT,STR,BF,USF,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | Adhesive | ||||
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2,099
In-stock
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Laird Technologies EMI | TWT,STR,NIS,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,057
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 065 NI 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Nickel | Flash | Adhesive | ||||
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1,573
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 065 SN 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
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2,236
In-stock
|
Leader Tech Inc. | 0.07 X 0.30 ST 24--6-30T-ST-24-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
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1,677
In-stock
|
Leader Tech Inc. | 0.10 X 0.30 X 070 SN 16--10-30C- | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
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2,509
In-stock
|
Leader Tech Inc. | 0.04 X 0.34 BD 16--4-34D-BD-16-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.040" (1.02mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||||
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3,890
In-stock
|
Leader Tech Inc. | 0.13 X 0.30 SN 0.356--13-30RH-SN | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.130" (3.30mm) | 0.356" (9.04mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | ||||
