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  4. RFI and EMI - Contacts, Fingerstock and Gaskets
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57 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
0097052001
RFQ
1,155
In-stock
 Laird Technologies EMI AP,STR,BF - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) - - Adhesive
Default Photo
0077008419
RFQ
952
In-stock
 Laird Technologies EMI NOSG,STR,NIB,PSA No Snag Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
13-S-37AH-ST-16
RFQ
3,083
In-stock
 Leader Tech Inc. 0.13 X 0.37 ST 16.0--13-S-37AH-S - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
Default Photo
0C97052019
RFQ
1,119
In-stock
 Laird Technologies EMI AP COIL NIB PSA All-Purpose Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Nickel 299.21µin (7.60µm) Adhesive
0077008302
0077008302
RFQ
2,153
In-stock
 Laird Technologies EMI GASKET BECU 9.4X406.4MM No Snag Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) - - Adhesive
Default Photo
0077008317
RFQ
618
In-stock
 Laird Technologies EMI NOSG,STR,SNB,PSA No Snag Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
0078003317
RFQ
1,941
In-stock
 Laird Technologies EMI NOSG,STR,SNB,USFT,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21µin (7.60µm) Slot
Default Photo
0077003319
RFQ
1,517
In-stock
 Laird Technologies EMI NOSG,STR,NIB,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Nickel 299.21µin (7.60µm) Slot
Default Photo
0077003317
RFQ
627
In-stock
 Laird Technologies EMI NOSG,STR,SNB,PSA Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21µin (7.60µm) Slot
Default Photo
0C97052002
RFQ
896
In-stock
 Laird Technologies EMI AP COIL BF PSA All-Purpose Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) - - Adhesive
Default Photo
13-37AH-NI-16
RFQ
1,850
In-stock
 Leader Tech Inc. 0.13 X 0.37 NI 16--13-37AH-NI-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Nickel Flash Adhesive
Default Photo
13-37AH-SN-16
RFQ
1,786
In-stock
 Leader Tech Inc. 0.13 X 0.37 SN 16.0--13-37AH-SN- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
0077002502
0077002502
RFQ
1,480
In-stock
 Laird Technologies EMI GASKET BECU 9.4X18.4MM Slot Mount Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 0.725" (18.42mm) 0.370" (9.40mm) - - Slot
Default Photo
14-S-37FS-SN-16
RFQ
1,331
In-stock
 Leader Tech Inc. 0.14 X 0.36 SN 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
Default Photo
11-S-37FSC-SN-16
RFQ
1,830
In-stock
 Leader Tech Inc. 0.11 X 0.375 SN 16--FOLDED SERIE - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
0077003302
0077003302
RFQ
2,200
In-stock
 Laird Technologies EMI GASKET BECU 9.4X406.40MM No Snag Active Beryllium Copper 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) - - Adhesive
0097052502
0097052502
RFQ
3,741
In-stock
 Laird Technologies EMI .140X.370 GASKET FABRIC O/ FOAM - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) - - Adhesive
Default Photo
14-S-37FSV30-SN-16
RFQ
1,238
In-stock
 Leader Tech Inc. 0.14 X 0.37 SN 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
Default Photo
14-37FS-SN-16
RFQ
762
In-stock
 Leader Tech Inc. 0.14 X 0.36 BD SN 16--FOLDED SER - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
Default Photo
14-37FSV30-SN-16
RFQ
979
In-stock
 Leader Tech Inc. 0.14 X 0.37 SN 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
Default Photo
0098052019
RFQ
1,890
In-stock
 Laird Technologies EMI AP,STR,NIB,USFT,PSA - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
0098052017
RFQ
2,162
In-stock
 Laird Technologies EMI AP,STR,SNB,USFT,PSA - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
14-S-37FS-BD-16
RFQ
2,106
In-stock
 Leader Tech Inc. 0.14 X 0.36 BD 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
Default Photo
11-S-37FSC-BD-16
RFQ
2,937
In-stock
 Leader Tech Inc. 0.11 X 0.375 BD 16--FOLDED SERIE - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
Default Photo
14-S-37FSV30-BD-16
RFQ
2,938
In-stock
 Leader Tech Inc. 0.14 X 0.37 BD 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
Default Photo
13-S-37AH-BD-16
RFQ
1,039
In-stock
 Leader Tech Inc. 0.13 X 0.37 BD 16--13-S-37AH-BD- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
Default Photo
0097052019
RFQ
672
In-stock
 Laird Technologies EMI AP,STR,NIB,PSA - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
0097052017
RFQ
3,818
In-stock
 Laird Technologies EMI AP,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
0097052008
RFQ
3,964
In-stock
 Laird Technologies EMI AP,STR,SNSAT,PSA - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21µin (7.60µm) Adhesive
0097052002
0097052002
RFQ
1,405
In-stock
 Laird Technologies EMI GASKET BECU 9.4X406.40MM - Active Beryllium Copper 121°C Fingerstock - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) - - Adhesive
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