- Manufacture :
- Series :
- Operating Temperature :
- Height :
- Plating - Thickness :
- Attachment Method :
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20 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
1,952
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 130 SN 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
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1,740
In-stock
|
Laird Technologies EMI | CSTR COIL ZNY | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
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2,798
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 120 NI 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | ||||
|
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1,205
In-stock
|
Laird Technologies EMI | CLO,STR,SNB,USFT | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.260" (6.60mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
|
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2,885
In-stock
|
Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
|
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1,576
In-stock
|
Laird Technologies EMI | CSTR COIL NIB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
|
3,976
In-stock
|
Laird Technologies EMI | CSTR COIL NIE | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
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1,369
In-stock
|
Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
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3,392
In-stock
|
Laird Technologies EMI | AP PCS SNSAT CTL | - | Active | - | - | - | - | - | 1.090" (27.69mm) | - | - | - | ||||
|
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1,881
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 NI 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | ||||
|
2,088
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||||
|
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2,986
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
|
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1,074
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SN 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
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2,255
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SU 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
|
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2,504
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
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3,428
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
|
1,011
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 130 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
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|
813
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 120 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
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1,951
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 070 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
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3,346
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 27.69MMX406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||||
