- Series :
- Material :
-
- Beryllium Copper (9)
- Beryllium Copper Alloy (2)
- Copper Alloy (6)
- Phosphor Bronze (3)
- Polyurethane Foam, Nickel-Copper Polyester (NI/CU) (1)
- Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) (2)
- Polyurethane Foam, Rayon Paper (1)
- Polyurethane Foam, Tin-Copper Polyester (SN/CU) (3)
- Stainless Steel (5)
- Titanium Copper (3)
- Operating Temperature :
- Shape :
- Plating :
- Plating - Thickness :
- Attachment Method :
- Applied Filters :
37 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
3,040
In-stock
|
Laird Technologies EMI | GK NICU NRS PU V0 REC | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | Fabric Over Foam | Rectangle | 0.138" (3.50mm) | 39.370" (100.00cm) | 0.350" (8.90mm) | - | - | - | ||||
|
3,813
In-stock
|
TE Connectivity AMP Connectors | SHIELD FINGER 3525 | - | Active | - | - | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | - | - | Solder | ||||
|
|
3,236
In-stock
|
TE Connectivity AMP Connectors | SHIELD FINGER 3525 | - | Active | - | - | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | - | - | Solder | ||||
|
RFQ |
2,030
In-stock
|
Harwin Inc. | RFI SHIELD FINGER AU 3.5MM SMD | EZ BoardWare | Active | Copper Alloy | -55°C ~ 125°C | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | |||
|
|
1,815
In-stock
|
Harwin Inc. | RFI SHIELD FINGER AU 3.5MM SMD | EZ BoardWare | Active | Copper Alloy | -55°C ~ 125°C | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
|
|
1,495
In-stock
|
Harwin Inc. | RFI SHIELD FINGER AU 3.5MM SMD | EZ BoardWare | Active | Copper Alloy | -55°C ~ 125°C | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
|
RFQ |
3,442
In-stock
|
ITT Cannon, LLC | MICRO UNIVERSAL CONTACT Z 3.5MM | - | Active | Titanium Copper | - | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11µin (3.00µm) | Solder | |||
|
|
3,785
In-stock
|
ITT Cannon, LLC | MICRO UNIVERSAL CONTACT Z 3.5MM | - | Active | Titanium Copper | - | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11µin (3.00µm) | Solder | ||||
|
|
1,720
In-stock
|
ITT Cannon, LLC | MICRO UNIVERSAL CONTACT Z 3.5MM | - | Active | Titanium Copper | - | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11µin (3.00µm) | Solder | ||||
|
|
RFQ |
1,214
In-stock
|
Laird Technologies EMI | METAL FILM OVER FOAM CONTACTS | - | Active | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | -40°C ~ 70°C | Film Over Foam | Rectangle | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | |||
|
|
3,132
In-stock
|
Laird Technologies EMI | METAL FILM OVER FOAM CONTACTS | - | Active | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | -40°C ~ 70°C | Film Over Foam | Rectangle | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||||
|
|
2,681
In-stock
|
Laird Technologies EMI | METAL FILM OVER FOAM CONTACTS | - | Active | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | -40°C ~ 70°C | Film Over Foam | Rectangle | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||||
|
|
3,240
In-stock
|
Amphenol FCI | 3.50MM HEIGHT UNIVERSAL CONTACT | - | Active | Beryllium Copper Alloy | - | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Gold | Flash | Solder | ||||
|
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3,578
In-stock
|
Amphenol FCI | ANTENNA 3.5H TI CU G/F P | - | Active | Beryllium Copper Alloy | - | Shield Finger, Pre-Loaded | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.055" (1.40mm) | Gold | Flash | Solder | ||||
|
1,612
In-stock
|
Wurth Electronics Inc. | WE-LT CONDUCTIVE SHIELDING GASKE | WE-LT | Active | Polyurethane Foam, Rayon Paper | -40°C ~ 85°C | Fabric Over Foam | D-Shape | 0.138" (3.50mm) | 39.370" (1.00m) | 0.335" (8.50mm) | - | - | Non-Conductive Adhesive | ||||
|
|
2,121
In-stock
|
Laird Technologies EMI | GK NICU PTAFG PU V0 REC | - | Active | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | Fabric Over Foam | Rectangle | 0.138" (3.50mm) | 12.000" (304.80mm) | 0.350" (8.90mm) | - | - | Adhesive | ||||
|
2,069
In-stock
|
Laird Technologies EMI | GASKET FAB/FOAM 8.9X457.2MM RECT | - | Active | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | Fabric Over Foam | Rectangle | 0.138" (3.50mm) | 18.000" (457.20mm) | 0.350" (8.90mm) | - | - | Adhesive | ||||
|
RFQ |
1,865
In-stock
|
Wurth Electronics Inc. | WE-SECF SMD EMI CONTACT FINGER | WE-SECF | Active | Beryllium Copper | -40°C ~ 100°C | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | |||
|
|
3,878
In-stock
|
Wurth Electronics Inc. | WE-SECF SMD EMI CONTACT FINGER | WE-SECF | Active | Beryllium Copper | -40°C ~ 100°C | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
|
|
1,867
In-stock
|
Wurth Electronics Inc. | WE-SECF SMD EMI CONTACT FINGER | WE-SECF | Active | Beryllium Copper | -40°C ~ 100°C | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
|
RFQ |
1,487
In-stock
|
Wurth Electronics Inc. | CONTACT FINGER EMI SMD | WE-SECF | Active | Beryllium Copper | -40°C ~ 100°C | Shield Finger | - | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | |||
|
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2,369
In-stock
|
Wurth Electronics Inc. | CONTACT FINGER EMI SMD | WE-SECF | Active | Beryllium Copper | -40°C ~ 100°C | Shield Finger | - | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
|
|
987
In-stock
|
Wurth Electronics Inc. | CONTACT FINGER EMI SMD | WE-SECF | Active | Beryllium Copper | -40°C ~ 100°C | Shield Finger | - | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
|
RFQ |
2,556
In-stock
|
Harwin Inc. | RFI SHIELD FINGER GOLD 3.5MM SMD | EZ BoardWare | Active | Stainless Steel | -55°C ~ 125°C | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | |||
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|
1,076
In-stock
|
Harwin Inc. | RFI SHIELD FINGER GOLD 3.5MM SMD | EZ BoardWare | Active | Stainless Steel | -55°C ~ 125°C | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
|
|
1,874
In-stock
|
Harwin Inc. | RFI SHIELD FINGER GOLD 3.5MM SMD | EZ BoardWare | Active | Stainless Steel | -55°C ~ 125°C | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
|
RFQ |
1,850
In-stock
|
TE Connectivity AMP Connectors | SHIELDFINGER3525Z | - | Active | Copper Alloy | - | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967µin (0.05µm) | Solder | |||
|
|
1,995
In-stock
|
TE Connectivity AMP Connectors | SHIELDFINGER3525Z | - | Active | Copper Alloy | - | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967µin (0.05µm) | Solder | ||||
|
|
3,641
In-stock
|
TE Connectivity AMP Connectors | SHIELDFINGER3525Z | - | Active | Copper Alloy | - | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967µin (0.05µm) | Solder | ||||
|
3,041
In-stock
|
Harwin Inc. | EMI SHIELD FINGER T&R(2000/R) | EZ BoardWare | Active | Stainless Steel | -55°C ~ 125°C | Shield Finger | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Tin | 98.43µin (2.50µm) | Solder | ||||
